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CMP Process Engineer (Manager / Senior Engineer) Job Opening In Singapore, Singapore – Now Hiring Reeracoen Singapore Pte. Ltd.

CMP Process Engineer (Manager / Senior Engineer)

    Singapore Jobs Expertini Expertini Singapore Jobs Engineers Cmp Process Engineer (Manager / Senior Engineer)

Job description

Job Description

Our client is launching a new business and establishing a new factory in Singapore.

They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing.

Reports to: R&D Manager

【 Responsibilities 】

1) Process Development & Optimization
- Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing.
- Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

2) Equipment & Tooling Support
- Define equipment specifications and validate CMP tools.
- Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

3) Yield & Quality Improvement
- Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination).
- Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection.

4) Process Integration
- Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration.
- Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies.

5) Data Analysis & Documentation
- Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
- Document standard operating procedures (SOPs), work instructions, and control plans.

6) Cross-Functional Collaboration
- Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI).
- Assist with customer qualifications and reliability testing as needed.

Qualifications

  • Requirement

    【 Requirements & Preferences 】

    (Must):
    - PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
    - 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing.
    - Hands-on experience with CMP tools.
    - Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or embedding.
    - Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
    - Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
    - Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes.
    - Strong analytical, documentation, and problem-solving skills.
    - Effective communication and teamwork in a cross-functional environment.

  • English Level

    -

  • Other Language

    -

  • Additional Information

  • Benefit

    【 What you will receive 】
    - AWS
    - Variable Bonus (based on company and individual performance)
    - Annual Leave: 16 days (up to a maximum of 20 days)
    - Medical Leave
    - Family care leave (2 days/year)
    - Dental care
    - Company phone will be provided

  • Working Hour

    8:00 ~ 17:00

  • Holiday

    -

  • Job Function

  • Required Skill Profession

    Engineers


    • Job Details

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    Unlock Your CMP Process Potential: Insight & Career Growth Guide


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