Job Responsibilities
Process Development & Optimization
Develop and optimize coating processes for photoresist, and dielectric materials (e.g., PID, PI) on package substrates.
Establish uniform coating parameters to ensure consistent layer thickness and adhesion.
Optimize oven/thermal curing profiles for soft bake, hard bake, pre-bake, post-exposure bake (PEB), or final curing.
Tool Management & Setup
Define tool requirements and support installation and qualification of coaters, hot plates, and curing ovens.
Maintain and troubleshoot coating and baking equipment to ensure uptime and performance.
Work with equipment vendors and facilities teams on preventive maintenance and upgrades.
Process Monitoring & Control
Monitor coating quality, film thickness uniformity, and oven cure parameters using metrology tools (e.g., ellipsometry, thickness gauges, bake sensors).
Implement process control plans, including SPC charts and run-to-run feedback control.
Validate material compatibility, adhesion strength, thermal stability, and outgassing behavior.
Defect Prevention & Yield Improvement
Identify and resolve coating and baking-related defects.
Collaborate with upstream and downstream teams to ensure integrated process stability.
Documentation & Compliance
Create and maintain technical documentation including SOPs, process specs, recipes, and FMEAs.
Ensure all processes comply with environmental, safety, and chemical handling standards.
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Job Requirements
Professional Qualifications:
PhD or Master’s degree in Chemical Engineering, Materials Science, Microelectronics, or a related field.
5–10+ years of experience in coating and thermal process development in substrate, PCB, or semiconductor manufacturing.
Familiarity with coating materials such as photoresists, ABF, PI, solder mask, and related chemistries.
Specialized Knowledge & Skills:
Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding.
Strong analytical and problem-solving skills; experience with DOE and SPC tools.
Ability to work cross-functionally in a fast-paced, high-volume production or R&D environment.
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