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Urgent! Design Engineer (Die Ejection Systems) | TCB (Thermo Compression Bonding) | Thin Die & CoW Packages | Oxygen & Environmental Control Systems | Up to 8k | Admiralty - 4769 - Islandwide, SG Job Opening In Singapore, Singapore – Now Hiring THE SUPREME HR ADVISORY PTE. LTD.

Design Engineer (Die Ejection Systems) | TCB (Thermo Compression Bonding) | Thin Die & CoW Packages | Oxygen & Environmental Control Systems | Up to 8k | Admiralty 4769 Islandwide, SG



Job description

Roles & Responsibilities

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location: 8 Admiralty Stree
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment.

The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly.

This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

  • Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).

  • Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.

  • Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.

  • Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.

  • Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.

  • Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.

  • Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.

  • Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.

  • Analyze yield loss due to ejection-related defects and implement design or process improvements.

  • Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

  • Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.

  • 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.

  • Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.

  • Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.

  • Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.

  • Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.

  • Prior involvement in CoWoS, 2.5D, or HBM packaging processes.

  • Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.

  • Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.

  • Experience collaborating with process, electrical, and software teams in semiconductor tool development.

The Supreme HR Advisory Pte Ltd | 14C7279
Ong Boon Kiet (Travys) | R
Senior Recruitment Consultant

WA ME @

Tell employers what skills you have
Compression
Thermal Analysis
Contamination Control
3D
Chemistry
Vacuum Systems
Packaging
Sensors
CAD
Commissioning
Environmental Control
Mechanical Engineering
Calibration
ANSYS


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