Job Description
The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products.
This position is essential to the company's mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates.
The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.
Job Requirement
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
- Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries.
- Proven track record of developing and scaling dicing processes for glass and silicon wafers.
- Deep understanding of wafer materials, mechanical properties, and dicing-induced stress.
- Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.
- Familiarity with Cleanroom practices and wafer handling protocols.
- Strong Problem-solving and communication skills.
- Strong Team spirit, sense of responsibility, result-oriented mindset and practical work ethics.