Position Summary:
The Electrical Engineer will design and integrate high-precision control electronics for motion, force, and thermal subsystems within the Thermocompression Bonder.
The role requires deep experience in sensor signal conditioning, low-noise circuit design, and real-time feedback systems capable of sub-micron and sub-Newton accuracy.
Key Responsibilities:
- Design and integrate servo drives, force sensors, and displacement measurement systems.
- Develop and tune PID/Feedforward control loops for micro-force (<1 N) and micro-Z height (<1 µm) control.
- Select, interface, and calibrate load cells, LVDTs, capacitance probes, and optical encoders.
- Integrate high-ramp heating modules with precise thermocouple feedback and PID tuning.
- Implement collimator and tilt sensing circuits for angular alignment compensation.
- Work with software engineers to develop high-bandwidth sensor-to-controller data paths.
- Ensure EMI/ESD compliance, grounding integrity, and system signal stability.
- Conduct electrical debugging, reliability validation, and sensor calibration at system level.
Required Qualifications:
- Bachelor's or Master's in Electrical Engineering, Electronics, or Instrumentation Engineering.
- 5+ years of experience in precision control electronics, motion control, or test instrumentation.
- Knowledge of EtherCAT, CANopen, and analog I/O systems.
- Familiarity with signal conditioning for microvolt/millinewton-level measurements.
- Hands-on experience with temperature control circuits using RTD or thermocouple sensors.
Preferred Qualifications:
- Experience with Beckhoff I/O modules, ACS SPiiPlus, Galil DMC, or Delta Tau PMAC.
- Background in bonding or precision assembly systems.
- Familiarity with Simulink Real-Time or LabVIEW FPGA for high-speed control prototyping.