Role Overview
Develop and optimize high-precision mechanical modules for advanced semiconductor packaging, ensuring performance, reliability, and seamless integration with cross-functional teams.
Key Responsibilities
- Translate customer requirements into detailed mechanical design specifications.
- Perform force, thermal, vibration simulations, and module lifetime analysis.
- Select materials and design solutions balancing durability, cost, and manufacturability.
- Design precision tooling and fixtures for semiconductor packaging processes.
- Develop 3D models and conduct structural analysis.
- Collaborate with manufacturing and process teams for design-for-manufacturability (DFM).
- Support continuous improvement to enhance performance, efficiency, and reliability.
- Ensure compliance with safety, quality, and environmental standards.
Ideal Requirements
- Degree or higher in Mechanical Engineering or related field.
- Experience in mechanical design, preferably in semiconductor or high-precision equipment.
- Proficient in Solid Edge, SolidWorks, Pro-E, AutoCAD.
- Knowledge of advanced packaging technologies (wafer-level packaging, 2.5D/3D integration, flip-chip assembly) is a plus.
- Understanding of thermal management, vibration control, and precision motion systems advantageous.
If you would like to be considered for this opportunity, please forward a copy of your full CV to
Data provided is for recruitment purposes only.
Only shortlisted candidates will be notified.
Business Registration Number : D | Licence Number : 10C5117 | EA Registration Number: R