We are seeking an experienced Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment.
The ideal candidate will have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly.
This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.
Key Responsibilities
- Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
- Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
- Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
- Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
- Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
- Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
- Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
- Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
- Analyze yield loss due to ejection-related defects and implement design or process improvements.
- Support cross-functional teams in root-cause analysis and failure prevention.
Required Qualifications
- Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
- 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
- Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
- Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
- Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
- Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
Preferred Experience (Definite Plus)
- Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
- Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
- Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
- Experience collaborating with process, electrical, and software teams in semiconductor tool development.
Soft Skills
- Strong analytical and problem-solving abilities.
- Excellent communication and cross-functional collaboration skills.
- Self-motivated and able to work independently in a fast-paced environment.
Why Join Us
- Opportunity to design next-generation thermocompression and die handling equipment for advanced packaging nodes.
- Work with leading experts in semiconductor equipment innovation.
- Higher than market compensation and growth opportunities in a high-impact R&D environment.