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Mechanical Design Engineer ThermoCompression Bonding Job Opening In North East Community Development Council – Now Hiring The Supreme HR Advisory Pte Ltd


Job description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street
Working Days:  5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development

  • Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

  • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).

  • Planning, Scheduling and Costing of Machines Modules.

  • Prototyping & Testing

  • Oversee fabrication of prototype modules and their integration with TCB platforms.

  • Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

  • Process & Manufacturing Support

  • Collaborate with Electrical, Vision and Software Engineers for the machine integration.

  • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

  • Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

  • Compliance & Documentation

  • Document all designs, simulations, and test results according to quality management and IP standards.

  • Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis

  • Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.

  • Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.

  • Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred.

    Exposure to CREO Windchill PLM system is a plus.

  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.

  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.

    Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.

  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants can also send your resume to WA: Mr Samuel) and allow our Consultant to match you with our Clients.

No Charges will be incurred by Candidates for any service rendered.

Samuel Siaw

The Supreme HR Advisory Pte Ltd

EA No: 14C7279

Reg No: R

Required Skill Profession

Other General


  • Job Details

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Unlock Your Mechanical Design Potential: Insight & Career Growth Guide


Real-time Mechanical Design Jobs Trends (Graphical Representation)

Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph here. Uncover the dynamic job market trends for Mechanical Design in North East Community Development Council, Singapore, highlighting market share and opportunities for professionals in Mechanical Design roles.

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An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at The Supreme HR Advisory Pte Ltd adheres to the cultural norms as outlined by Expertini.

The fundamental ethical values are:

1. Independence

2. Loyalty

3. Impartiapty

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5. Accountabipty

6. Respect for human rights

7. Obeying Singapore laws and regulations

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The average salary range for a varies, but the pay scale is rated "Standard" in North East Community Development Council. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.

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Other Openings

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