Mechatronics Engineer – Thermocompression Bonder Development
We are seeking a highly skilled Mechatronics Engineer to join our Thermocompression Bonder (TCB) development team.
The ideal candidate will possess strong experience in precision motion control systems, force sensing and feedback, and thermal‐mechanical alignment technologies.
This role is central to the design and optimization of high‐accuracy bonding systems for advanced semiconductor packaging applications such as HBM, CoWoS, and 2.5D integration.
Key Responsibilities
Design and develop precision motion stages for X‐Y‐θ‐Z control, ensuring sub‐micron positioning accuracy under thermal load conditions.
Integrate and calibrate force and load cell sensors for precise bonding pressure control and real‐time feedback.
Develop control algorithms for closed‐loop micro Z and force management during the TCB bonding cycle.
Engineer and tune precision alignment systems that maintain stability and accuracy at elevated bonding temperatures.
Collaborate with control engineers to implement advanced motion profiles for synchronized actuation and heating sequences.
Design and qualify high‐ramp heating systems with uniform temperature profiles and minimal mechanical distortion.
Develop tilt and collimation measurement systems for parallelism correction between bonding surfaces.
Support system integration, testing, and process validation for prototype and production‐level TCB platforms.
Work with cross‐functional teams including mechanical design, process, and software engineers to ensure system reliability and performance.
Required Qualifications
Bachelor’s or Master’s degree in Mechatronics, Mechanical Engineering, Electrical Engineering, or Precision Engineering.
5+ years of experience in precision motion systems, robotics, or semiconductor assembly equipment development.
Proven expertise in motion control systems, servo tuning, and PID‐based control architecture.
Hands‐on experience with force/torque sensing, load cell calibration, and signal conditioning.
Deep understanding of thermal effects on precision alignment systems and methods to compensate for expansion and drift.
Experience in micro Z and force control for bonding, dispensing, or pick‐and‐place systems.
Knowledge of high‐ramp heating mechanisms (e.g., induction, resistive, or infrared heating).
Familiarity with collimation and tilt measurement (e.g., autocollimator, interferometer, or laser‐based metrology).
Strong proficiency in MATLAB/Simulink, LabVIEW, or similar motion control and data acquisition platforms.
Preferred Qualifications
Experience with semiconductor packaging equipment, especially Thermocompression Bonder, Flip‐Chip, or Die Bonder systems.
Exposure to finite element modeling for thermal‐mechanical behavior analysis.
Working knowledge of industrial automation communication protocols (EtherCAT, CANOpen, etc.).
Familiarity with precision metrology tools and cleanroom equipment integration.
Personal Attributes
Strong analytical and problem‐solving skills with a systems‐thinking mindset.
Highly detail‐oriented, organized, and results‐driven.
Excellent communication and cross‐disciplinary collaboration abilities.
Self‐motivated and able to thrive in a fast‐paced R&D environment.
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