Home Vacancies NAND Process Integration Engineer at Micron (Singapore)
NAND Process Integration Engineer at Micron (Singapore)
Shape the future of 3D NAND through advanced nanofabrication and device-process innovation
July 29, 2025
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Micron is hiring for a
Senior/Principal NAND Process Integration Engineer
in
Singapore R&D .
Lead structural innovation, material selection, and electrical optimization for
next-gen 3D NAND
memory — a key career path in
nanoelectronics R&D .
Field
Nanotechnology, Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering
Title
Senior/Principal NAND Process Integration Engineer
Organization
Micron Technology Inc.
Work Location
Singapore
Research Focus
3D NAND Process Integration, Yield Engineering, Device Reliability
Application Deadline
Rolling
Posted Date
July 2025
Required Education
BS/MS/PhD in Electrical Engg., Materials, Chemical Engg., or related fields
Required Experience
3+ years in semiconductor process, preferably NAND process integration
Micron’s NAND Technology Integration (NTI) group in Singapore is driving the evolution of
3D NAND flash
with novel process structures, tighter geometries, and better reliability.
As a Process Integration Engineer, you’ll own key modules in the
vertical integration flow , optimizing both materials and electrical performance from
first silicon to HVM transfer .
Your work will bridge across:
Structural spec and electrical reliability optimization
New material screening and process modeling
Parametric, structural, and failure analysis for 3D NAND
Full cycle of R&D to manufacturing handoff
IP generation, innovation, and experimental design
This is a rare opportunity to impact
sub-10nm technology nodes
and future
non-volatile memory platforms
using advanced
nanoengineering strategies .
Expertise in
NAND process integration
or semiconductor device R&D
Strong grasp of
device-structure-performance interactions
Hands-on with data analysis tools: Python, Power BI, Tableau, JMP, etc.
Able to lead module development across
materials, fab, and yield teams
Passion for
technology transfer , innovation, and end-to-end device development
Preferred:
Prior experience in
NAND architecture , structural yield loss, or BEOL interactions
Exposure to
SolidWorks , DOE methodology, and memory reliability testing
PhD/MS with 3+ years of process or device R&D experience
Micron’s Singapore fab is one of the world’s largest and most advanced NAND manufacturing sites, offering:
A strong R&D ecosystem in
non-volatile memory
Global exposure to leading fabs and technology nodes
A culture of
IP creation , learning, and collaboration
Access to
cutting-edge equipment
and
cross-domain mentorship
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