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Urgent! Package Design Engineer Job Opening In Singapore, Singapore – Now Hiring SILICON BOX PTE. LTD.

Package Design Engineer



Job description

Roles & Responsibilities

Package Design Engineer is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

  • With reference to internal design guidelines, work with the internal & external customer to:
  1. Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.

  2. Generate test vehicle design and the related PCB design.

  3. Prepare design risk assessment report.

  4. Generate reticle and stencil design.

  5. Generate other schematics or drawing as requested.

  • Review, maintenance and update the design guidelines.

  • Manage the conversion of internal design into suppliers' final design.

  • Document all the drawing revisions and change records.

  • Support audits
  • Any other ad-hoc duties as assigned

Requirement

  • Minimum Degree in electrical engineering or similar discipline
  • Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
  • Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage
  • Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
  • Experience with PCB test board design
  • Fresh graduates are welcome to apply
Tell employers what skills you have
Risk Assessment
Process Capability
Drawing
Electrical
3D
Packaging
Audits
PCB Design
Cadence
AutoCAD
Electrical Engineering
Layout


Required Skill Profession

Other General



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    Unlock Your Package Design Potential: Insight & Career Growth Guide


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