Job Responsibilities
Process Development
Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
Evaluate new chemicals, materials, and equipment for plating process enhancement.
Establish plating parameters to ensure uniform thickness, adhesion, and reliability.
Process Control & Monitoring
Monitor plating bath chemistry and maintain proper control limits.
Implement Statistical Process Control (SPC) and DOE to analyze process capability.
Troubleshoot process and equipment issues to improve yield and throughput.
Yield & Quality Improvement
Conduct root cause analysis of plating defects.
Work with quality and reliability teams to address substrate failure mechanisms.
Drive continuous improvement initiatives to enhance quality and cost efficiency.
Cross-Functional Collaboration
Interface with design, manufacturing, equipment, and suppliers to meet production goals.
Support new product introductions (NPI) and qualification of plating processes.
Documentation & Compliance
Maintain detailed documentation of plating recipes, process controls, and specs.
Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Job Requirements
Professional Qualifications:
PhD or Master’s degree in Chemical Engineering, Materials Science, or related field.
5–10+ years of experience in semiconductor packaging or PCB/substrate manufacturing.
Hands-on experience with copper/nickel/tin plating processes.
Familiarity with tools such as XRF, SEM, profilometer, and electroplating equipment.
Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.
Specialized Knowledge & Skills:
Strong analytical and problem-solving skills.
Knowledge of surface treatment, adhesion promotion, and via filling techniques.
Familiar with lean manufacturing, Six Sigma, or SPC tools.
Excellent communication and teamwork abilities.
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