Job description
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies.
With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
For more information, visit www.gf.com .
Summary of Role:
GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive next-generation multi-layer stacking for hybrid bonding development.
Essential Responsibilities:
+ Lead 3DHI process development efforts for the building blocks required for advanced packaging solution s needed in the product lines (e.g. , multi-die stacking, fine pitch hybrid bond ing , etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.
+ Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
+ Develop expertise in the processes, materials and tooling leveraging available characterization resources.
Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
+ Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D HI processes.
+ Drive understanding of failure modes.
+ Facilitate a dvanced p ackaging interactions between the GF Singapore Product Line/Fab teams and customers.
+ Generate IP related to novel wafer integration & packaging technology.
Other Responsibilities:
+ Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
+ Take part in hiring of other Advanced Packaging team members in Singapore.
+ Mentor and guide new hires to assume their roles and responsibilities.
+ Other duties as assigned by manager.
Required Qualifications:
+ Education – Master’s in Electrical Engineering , Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
+ MS degree with at least 1 2 years of prior related work experience.
+ Must have at least an overall 3.0 GPA and proven good academic standing.
+ Language Fluency - English (Written & Verbal).
+ Travel - Up to 20%.
Preferred Qualifications:
+ Education – PhD education level preferred with at least 10 years of prior related work experience.
+ Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
+ Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
+ Strong written and verbal communication skills .
+ Strong planning & organizational skills.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
Required Skill Profession
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