Job Description
The role is to develop, optimize, and sustain high-precision pick-and-place and reconstruction processes for glass optics modules and silicon dies used in advanced photonics and semiconductor packaging.
This role also ensures robust process integration, high yield, and alignment accuracy to meet stringent optical and electrical performance requirements for next-generation devices.
The engineer will work closely with cross-functional teams to ensure high yield, throughput, and quality in production and development environments.
Job Requirement
- Bachelor's or master's degree in mechanical engineering, Materials Science, Optoelectronics, or related field.
- 5+ years of hands-on experience in pick-and-place and reconstruction processes, preferably in optics or semiconductor packaging.
- Proficiency in handling glass optics, silicon dies, and wafer-level packaging technologies
- Strong understanding of adhesive bonding, thermal curing, and alignment systems (Datacon, Mühlbauer )
- Experience with statistical process control (SPC), DOE, and failure analysis.
- Familiarity with cleanroom practices and wafer handling protocols.
- Strong problem-solving and communication skills.
- Proficiency in statistical analysis tools (e.g., JMP, Minitab) and process control methodologies.