Urgent! Principal/Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering Job Opening In Singapore, Singapore – Now Hiring MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Micron’s vision is to transform how the world uses information to enrich life
for all
.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners.
The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible.
We do it all while committing to integrity, sustainability, and giving back to our communities.
Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life.
This proliferation is being fueled by advances in memory and compute technologies.
High bandwidth memory (HBM) is at the forefront of these innovations.
Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.
You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Key responsibilities and duties include:
Process Development:
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
Establish and improve process management projects to deliver technology node requirements
Equipment and Materials:
Evaluate and promote new equipment and materials to enhance process capabilities
Set up process parameters for a variety of semiconductor equipment
Evaluate, promote, and plan for new equipment and materials
Quality Improvement:
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Ensure smooth transition from new product development, qualification, small volume production to high volume production
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
Experience with Visual Basic for automation and tool integration.
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
Tenacity to work effectively under timelines and limited resources
Consistent track record to solve problems and address root causes
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Great news! MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is currently hiring and seeking a Principal/Senior Engineer, APTD CEM Advanced Packaging Die Level Technology Engineering to join their team. Feel free to download the job details.
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