Know ATS Score
CV/Résumé Score
  • Expertini Resume Scoring: Our Semantic Matching Algorithm evaluates your CV/Résumé before you apply for this job role: Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering.
Singapore Jobs Expertini

Urgent! Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering Job Opening In Singapore, Singapore – Now Hiring MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering



Job description

Overview

Micron’s vision is to transform how the world uses information to enrich life for all.

Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners.

The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible.

We do it all while committing to integrity, sustainability, and giving back to our communities.

Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life.

This proliferation is being fueled by advances in memory and compute technologies.

High bandwidth memory (HBM) is at the forefront of these innovations.

Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.

You will also be required to identify, diagnose, and propose yield related breakthroughs.

You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Responsibilities

Technology Development:

  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
  • Integrate semiconductors while partnering with process and product engineering teams

Yield Improvement:

  • Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
  • Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
  • Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Quality Improvement:

  • Ensure defense coverage through process, measurement, inspection, and testing
  • Establish correlations between defense mechanisms to identify improvement opportunities
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

  • Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production
  • Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Qualifications

  • B.S./M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Materials, or other related technical fields
  • 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
  • Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
  • Experience with Visual Basic for automation and tool integration
  • Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
  • Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
  • Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering teams
  • Ability to resolve complex issues through root-cause or model-based problem solving
  • Tenacity to work effectively under timelines and limited resources
  • Consistent track record to solve problems and address root causes

#J-18808-Ljbffr


Required Skill Profession

Software Architecture & Engineering



Your Complete Job Search Toolkit

✨ Smart • Intelligent • Private • Secure

Start Using Our Tools

Join thousands of professionals who've advanced their careers with our platform

Rate or Report This Job
If you feel this job is inaccurate or spam kindly report to us using below form.
Please Note: This is NOT a job application form.


    Unlock Your Principal Senior Potential: Insight & Career Growth Guide


  • Real-time Principal Senior Jobs Trends in Singapore, Singapore (Graphical Representation)

    Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for Principal Senior in Singapore, Singapore using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 31018 jobs in Singapore and 27464 jobs in Singapore. This comprehensive analysis highlights market share and opportunities for professionals in Principal Senior roles. These dynamic trends provide a better understanding of the job market landscape in these regions.

  • Are You Looking for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering Job?

    Great news! is currently hiring and seeking a Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering to join their team. Feel free to download the job details.

    Wait no longer! Are you also interested in exploring similar jobs? Search now: .

  • The Work Culture

    An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. adheres to the cultural norms as outlined by Expertini.

    The fundamental ethical values are:
    • 1. Independence
    • 2. Loyalty
    • 3. Impartiality
    • 4. Integrity
    • 5. Accountability
    • 6. Respect for human rights
    • 7. Obeying Singapore laws and regulations
  • What Is the Average Salary Range for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering Positions?

    The average salary range for a varies, but the pay scale is rated "Standard" in Singapore. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.

  • What Are the Key Qualifications for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering?

    Key qualifications for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering typically include Software Architecture & Engineering and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.

  • How Can I Improve My Chances of Getting Hired for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering?

    To improve your chances of getting hired for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering, consider enhancing your skills. Check your CV/Résumé Score with our free Tool. We have an in-built Resume Scoring tool that gives you the matching score for each job based on your CV/Résumé once it is uploaded. This can help you align your CV/Résumé according to the job requirements and enhance your skills if needed.

  • Interview Tips for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering Job Success
    MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. interview tips for Principal/Senior Engineer, APTD CEM   Advanced Packaging Integration Engineering

    Here are some tips to help you prepare for and ace your job interview:

    Before the Interview:
    • Research: Learn about the MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.'s mission, values, products, and the specific job requirements and get further information about
    • Other Openings
    • Practice: Prepare answers to common interview questions and rehearse using the STAR method (Situation, Task, Action, Result) to showcase your skills and experiences.
    • Dress Professionally: Choose attire appropriate for the company culture.
    • Prepare Questions: Show your interest by having thoughtful questions for the interviewer.
    • Plan Your Commute: Allow ample time to arrive on time and avoid feeling rushed.
    During the Interview:
    • Be Punctual: Arrive on time to demonstrate professionalism and respect.
    • Make a Great First Impression: Greet the interviewer with a handshake, smile, and eye contact.
    • Confidence and Enthusiasm: Project a positive attitude and show your genuine interest in the opportunity.
    • Answer Thoughtfully: Listen carefully, take a moment to formulate clear and concise responses. Highlight relevant skills and experiences using the STAR method.
    • Ask Prepared Questions: Demonstrate curiosity and engagement with the role and company.
    • Follow Up: Send a thank-you email to the interviewer within 24 hours.
    Additional Tips:
    • Be Yourself: Let your personality shine through while maintaining professionalism.
    • Be Honest: Don't exaggerate your skills or experience.
    • Be Positive: Focus on your strengths and accomplishments.
    • Body Language: Maintain good posture, avoid fidgeting, and make eye contact.
    • Turn Off Phone: Avoid distractions during the interview.
    Final Thought:

    To prepare for your Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering interview at MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD., research the company, understand the job requirements, and practice common interview questions.

    Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.'s products or services and be prepared to discuss how you can contribute to their success.

    By following these tips, you can increase your chances of making a positive impression and landing the job!

  • How to Set Up Job Alerts for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering Positions

    Setting up job alerts for Principal/Senior Engineer, APTD CEM Advanced Packaging Integration Engineering is easy with Singapore Jobs Expertini. Simply visit our job alerts page here, enter your preferred job title and location, and choose how often you want to receive notifications. You'll get the latest job openings sent directly to your email for FREE!