Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering.
We are seeking an Advanced Packaging Integration Engineer to join Micron’s Advanced Packaging Technology Development (APTD) team.
Our vision is to transform how the world uses information to enrich life for all.
We pursue innovation for customers and partners with integrity, sustainability, and community support.
Micron delivers solutions from VR to AI, memory and storage technologies, and is focused on high performance memory products and