Overview
Principal/Senior Engineer, Advanced Packaging Wafer Level Technology Engineering at Micron Technology.
Responsibilities
Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements.
You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.
Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
Upgrade process capabilities and reduce production costs
Establish and improve process management projects to deliver technology node requirements and scaling for next node
Evaluate and promote new equipment and materials to enhance process capabilities
Set up process parameters for a variety of semiconductor equipment
Evaluate, promote, and plan for new equipment and materials
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Ensure smooth transition from new product development, qualification, small volume production to high volume production
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities
Requirements
B.S./M.S./Ph.D. (or equivalent) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical fields
2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics
Experience with Visual Basic for automation and tool integration
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
Tenacity to work effectively under timelines and limited resources
Consistent track record to solve problems and address root causes
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.
Micron delivers a portfolio of high-performance DRAM, NAND, and NOR memory and storage products.
For more information, visit micron.com/careers.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
For assistance with the application process, please contact Micron prohibits child labor and complies with applicable laws and regulations.
Micron does not charge candidates recruitment fees.
AI and fraud alerts: candidates should use AI tools responsibly and verify communications from Micron on the official careers site.
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Other
Industries
Computer Hardware Manufacturing
Appliances, Electrical, and Electronics Manufacturing
Semiconductor Manufacturing
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