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Process Engineer - Wafer-Bonder-Dicing-Grinding
role at
Qualcomm
Job Area : Engineering Group, Engineering Group > Hardware Engineering
Company : RF360 Singapore Pte., Ltd.
General Summary : As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all.
As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products.
Minimum Qualifications :
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Job Responsibilities :
Drive cost reduction by eliminating waste, finding alternative sources, and implementing innovative solutions.
Lead quality investigations and continuous improvement programs to enhance process robustness.
Enforce line controls and ensure adherence to work instructions and procedures.
Apply hands-on involvement in daily operations.
Monitor and analyze SPC charts to drive improvements in process control.
Manage timely disposition of on-hold lots.
Conduct regular reviews and updates of OCAP, FMEA, Control Plans, Risk Assessments, and SIPOC.
Guide and train technicians in process problem-solving and technical competencies.
Demonstrate accountability and foster a strong sense of ownership and teamwork.
Ensure proper handling of non-conformance issues.
Maintain compliance with CSR, EHS, QM, ESD, 5S standards, and cleanroom protocols.
Education/Experience Requirements :
Bachelor’s degree in physics, Chemistry, Materials Science, Electronics, or Electrical Engineering.
Expert in semiconductor processes, with hands-on experience in Wafer-Bonding / Wafer-Dicing / Wafer-Grinding.
Fluent in statistical and quality tools, driving data-backed decisions.
Thrives under pressure, with unwavering commitment to results.
Proficient in MS PowerPoint, Excel, and Word for clear, effective communication.
Skills, Abilities & Knowledge :
Deep expertise in Wafer-fab or Pre-assembly or Backend -assembly - Wafer -Bonding / -Dicing / -Grinding processes, equipment, and materials.
Clear communicator with strong interpersonal skills and a collaborative mindset.
Sharp troubleshooter with a systematic approach to solving complex process issues.
Skilled in SPC and quality tools, driving precision and control.
Dynamic and resourceful, with a creative, self-driven attitude.
Analytical thinker with a knack for organizing data and pinpointing root causes.
Efficient multitasker, able to prioritize and deliver under tight deadlines.
Qualcomm is an equal opportunity employer.
If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process.
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