Process Engineering Lead

Responsibilities:

• Provide strategic direction and leadership for the 12 bumping engineering team, aligning with company goals and objectives
• Oversee the development, optimization, and qualification of 12 bumping processes, ensuring high yield, quality, and reliability
• Develop and execute a technology roadmap for 12 bumping, staying ahead of industry trends and requirements
• Collaborate with cross-functional teams, including manufacturing, quality, equipment engineering and RnD, to ensure seamless integration of bumping processes
• Manage resources, including personnel, equipment, and budget, to achieve departmental goals and objectives
• Foster a culture of innovation and continuous improvement, identifying opportunities for process enhancements and implementing changes
• Identify and mitigate risks associated with bumping processes, ensuring minimal impact on production and quality

Requirements:

• Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field
• Minimum 10-12 years of experience in bumping engineering or a related field, with experience in 12 wafer processing
• Strong technical expertise in bumping processes, including process development, integration, and optimization
• Proven leadership experience, with a track record of managing teams and driving strategic initiatives
• Excellent communication and collaboration skills, with ability to work with cross-functional teams
• Strong analytical and problem-solving skills, with ability to identify and resolve complex technical issues