Job Responsibilities
· Perform comprehensive wafer scrap analysis, identify root causes for low yield and drive Operations for improvements.
· Feedback and work closely with process modules on process-related low yield issues to come up with effective containment and corrective actions to prevent reoccurrence.
· Lead quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
· Identify potential frontend fab process steps/areas as opportunities for baseline yield improvement and work closely with process/equipment engineers via various yield improvement projects.
· Identify areas for yield improvement between Product and Process.
· Conduct Design of Experiment (DOE) to optimize process conditions and to define process windows.
· Apply hands-on and with deep involvement at work.
· Guide process technicians in problem solving and analysis.
· Take accountability of work and possess strong sense of responsibility.
· Provide process, failure and yield analyses and product trainings to all technicians to build up their technical
Education/Experience Requirements
· At least a Bachelor's degree in Electronic or Electrical Engineering or equivalent.
· Experience in high volume manufacturing of electronics components in an MNC or semi-conductor industry.
· Direct working experience in wafer fab process integration will be an added advantage.
· Possess strong technical competencies in his field of study.
· Able to work under pressure and with strong commitment at work.
· Good knowledge of statistical and quality tools.
· Experience with software applications such as MS Power Point, Excel and Word.