Process Integration Engineer – MEMS

Key Responsibilities

• Own MEMS process integration for both new device development and sustaining production, spanning concept, prototyping, pilot, and mass production phases.
  
  
• Translate MEMS device designs into scalable, manufacturable process flows, with an emphasis on design-for-manufacturability and innovation.
  
  
• Drive R&D of novel materials, unit processes, and integration schemes to enable improved performance, cost, and robustness of MEMS microphones.
  
  
• Develop, optimize, and debug front-end and back-end MEMS processes, balancing trade-offs in yield, reliability, cost, and cycle time.
  
  
• Collaborate with foundry fab teams (TD/PI/module owners) to qualify and improve critical process steps (e.g., DRIE, wafer bonding, thin film deposition, lithography, release).
  
  
• Lead structured problem-solving efforts (FA/RCA) and implement corrective actions for yield excursions or reliability failures.
  
  
• Interface with cross-functional teams—design, test, packaging, and reliability—to ensure seamless process integration across the value chain.
  
  
• Support new material selection and experimental trials in coordination with internal labs and external research partners.
  
  
• Generate and maintain thorough documentation: process flows, work instructions, control plans, FMEA documentation, qualification reports.
  
  and support design reviews and tape-outs.
  
  
• Participate in technology roadmap discussions and early-stage prototyping, influencing future MEMS platform direction.
  
  
• Manage Lab-to-Fab and Fab-to-Fab process transfers, ensuring smooth NPI ramp-up and scalable manufacturing.
  
  
• Support patent generation, technical publications, and research proposals related to MEMS integration innovations.
  
  

Required Qualifications

• Bachelor's, or Master's in Electrical Engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related field.
  
  
• 1–5+ years of experience in MEMS process, process integration, semiconductor process development, or microfabrication R&D.
  
  
• Deep familiarity with MEMS inertial sensors or similar devices (e.g., Accelerometer, Gyroscope, pressure sensors, or micro speakers).
  
  
• Experience with MEMS process modules such as DRIE, sacrificial release, LPCVD/PECVD, wafer bonding, and hermetic sealing.
  
  
• Hands-on knowledge of cleanroom tools, metrology, FA methods, and analytical techniques (SEM, AFM, nanoindentation, profilometry, acoustic/electrical test).
  
  
• Experience conducting design-of-experiments (DOE), data analysis (e.g., JMP, Python), and process characterization.
  
  
• Excellent communication skills; fluent in English and Mandarin preferred for interfacing with regional partners.
  
  
• Proactive, creative thinker who thrives in a cross-disciplinary, fast-paced R&D environment.