About the Role
We are looking for a detail-oriented Process Technician to support grinding, polishing, and chemical mechanical polishing (CMP) operations for MPCVD-grown diamond substrates .
You will play an essential role in day-to-day equipment operation, surface finishing, and quality checks to ensure diamond wafers meet stringent requirements for semiconductor and thermal management applications.
This role supports both R&D experiments and pilot production .
Key Responsibilities
- Operate and monitor grinding, lapping, polishing, and CMP equipment according to standard operating procedures (SOPs).
- Prepare diamond substrates and consumables (pads, slurries, abrasives) for processing runs.
- Perform surface quality inspections using optical tools, profilometers, and microscopes.
- Record process data accurately and report deviations to engineers.
- Assist engineers in process development, troubleshooting, and experiments.
- Carry out routine maintenance, calibration, and cleaning of polishing/CMP equipment.
- Ensure safe operations in a cleanroom or laboratory environment, following EHS standards.