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Scientist (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (SiP), IME Job Opening In Singapore, Singapore – Now Hiring A*STAR RESEARCH ENTITIES

Scientist (Multi Chiplet Heterogeneous Integration and High Speed IO Designer), (SiP), IME

    Singapore Jobs Expertini Expertini Singapore Jobs Other General Scientist (Multi Chiplet Heterogeneous Integration And High Speed Io Designer), (Sip), Ime

Job description

We are seeking a highly skilled Electrical Modeling, Applied Machine Learning engineer to join our team.

The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), with a focus on applied machine learning in advanced package physical design, high speed circuit modeling, design technology co optimization or system technology co optimization and analysis, signal / power integrity.

The successful candidate will play a crucial role in developing accelerating simulation and analysis technology towards design enablement of state-of-the‐art advanced packaging.


Key Responsibilities:
Develop performance models, feature engineering of Electrical /Thermal / Mechanical analysis of multi chiplet advanced packages
Collaborate with cross‐functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs
Data wrangling, EDA format parsing, generating custom databases for specific electrical, thermal and mechanical domain.


Perform benchmarking of various applicable AI / ML algorithm and Design of Experiments.


Integrate the AI / ML solution within the design flow for training and inference, develop and maintain data pipeline.


Participate in comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis
Stay up to date with the latest advancements, improve existing models, develop new ones and propose new applicable architectures.


Required Qualifications:
PhD in Electrical or Computer Engineering with relevant experience.


Understanding of advanced packaging /interconnect/I-O modelling, statistical analysis, signal/power integrity, thermal flow, stress and yield factors in advanced packaging.


Experience and Proficiency in Python, Tensorflow, Scikit, statistical packages, database SQL/no‐SQL, postgresSQL, vector databases.


Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.


Preferred Qualifications:
Ability to research, develop and implement AI/ ML algorithms using industry‐standard open‐source tools/methodologies.


Strong problem‐solving skills and the ability to think creatively to overcome technical challenges for cross domain implementations.


Excellent communication and collaboration skills, with the ability to work effectively in a team environment.


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Required Skill Profession

Other General


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