Our Client is a well establish Semicon company .
5 days week ; Monday- Friday
Role Overview:
Lead and develop wafer-level molding and related processes .
Focus is on process development, optimization, stabilization, and supporting transition to mass production.
Key Responsibilities:
- Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP).
- Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement.
- Qualify new materials, tools, and equipment for packaging and device integration.
- Validate processes pre-production and stabilize yield.
- Support customer programs with technical solutions and troubleshooting.
- Review and improve FMEA, OCAP, and control plans.
- Enhance molding, debond, and wafer resizing processes.
- Drive process yield and quality improvements.
- Support technical innovation in alignment with global customer needs.
Requirements:
- Bachelor's degree in Mechanical, Materials, or Electronics Engineering.
- At least 3 years' hands-on experience in wafer-level molding process engineering.
- In-depth knowledge of molding machines, materials, procedures, and quality standards.
- Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing).
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore
Tel:
EA License Number: 02C4944
EA Personnel Reg nos R
Job ID: 8XY47V33