Role Overview
Lead and develop wafer-level molding and related processes.
Focus is on process development, optimization, stabilization, and supporting transition to mass production.
Key Responsibilities
- Develop and optimize wafer-level molding and debonding processes for advanced packaging (2.5D, fan-out, SiP).
- Conduct DOE (Design of Experiments), data analysis (e.g., using JMP), and continuous process improvement.
- Qualify new materials, tools, and equipment for packaging and device integration.
- Validate processes pre-production and stabilize yield.
- Support customer programs with technical solutions and troubleshooting.
- Review and improve FMEA, OCAP, and control plans.
- Enhance molding, debond, and wafer resizing processes.
- Drive process yield and quality improvements.
- Support technical innovation in alignment with global customer needs.
Requirements
- Bachelor's degree in Mechanical, Materials, or Electronics Engineering.
- At least 3 years’ hands-on experience in wafer-level molding process engineering.
- In-depth knowledge of molding machines, materials, procedures, and quality standards.
- Familiarity with advanced packaging (2.5D, fan-out, flip-chip) and related processes (debonding, warpage, resizing).
Application Process
Please stating
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Notes
We regret that only shortlisted candidates will be notified.
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