Semiconductor Design Engineer | TCB Bonding Tech | 6K–8K | 5 Days

• Admiralty

• Attractive Salary Package

• Company Benefits & Incentives

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Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty
Working Days:  5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development

• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  
  

• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  
  
• Planning, Scheduling and Costing of Machines Modules.
  
  

• Prototyping & Testing

• Oversee fabrication of prototype modules and their integration with TCB platforms.
  
  

• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  
  

• Process & Manufacturing Support

• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  
  

• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  
  
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  
  

• Compliance & Documentation

• Document all designs, simulations, and test results according to quality management and IP standards.
  
  

• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
  
  

Good-to-have:

• Thermal & Mechanical Analysis

• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  
  

• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  
  
• Mounting of the heater assembly for micron-level Z positioning and planarity during operation.
  
  

Requirements

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  
  
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  
  
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred.
  
  Exposure to CREO Windchill PLM system is a plus.
  
  
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  
  
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

Email:

Chaw Chiaw Han, Reg No:R

The Supreme HR Advisory Pte Ltd, EA No:14c7279