Senior Engineer Bond/Grind/Trim Process Dev

Job description

Senior Engineer - Bond/Grind/Trim Process Dev
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Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners.

The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.

We do it all while committing to integrity, sustainability, and giving back to our communities.


Job Description
Micron’s NAND Process Development (PD) Singapore group is looking for a process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof, and to ensure extended engagement with manufacturing on the upcoming technology nodes.


Responsibilities
Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond.


Collaborate with process development engineers in Singapore and Boise (US TD site) and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes.


Transfer Bonding/Grind/Trim processes to high-volume manufacturing (Fab10) and drive continuous improvements to manufacturability.


Address process issues with Fab10 team and key business partners on tool choices for manufacturing and evaluations, as applicable.


Focus on understanding and improving process margins to meet mature yield goals for 3D NAND parts.


Perform fundamental research, consumables development, hardware evaluation, and testing of processes for novel applications in advanced 3D NAND Bonding/Grind/Trim development.


Initiate and manage experiments to widen process margins and test manufacturability of next-node solutions.


Identify process simplification opportunities and drive cross-functional teams in implementation.


Incorporate best manufacturing practices into the early development phase of upcoming nodes.


Design and implement advanced process monitoring and control methodologies.


Serve as a technical expert contributing to projects that improve processes, procedures, and equipment.


Define and lead complex, multi-functional projects of critical importance to Micron; help set strategic direction.


Lead teams, sites, or suppliers on complex, multi-disciplinary projects in quality-focused meetings, process and yield improvement meetings, and cost/productivity improvement meetings.


Provide advice to management on significant technical issues; lead innovation projects through patents and technical papers.


Collaborate with partners locally and globally while adhering to Micron Intellectual Property protection policies.


Participate in continuous worldwide TD engagement with suppliers to push for breakthrough solutions.


Requirements
Bachelors’ degree or higher in Materials Science, Chemical Engineering, or Physics with a minimum of 2 years hands-on experience in leading-edge Bonding/Grind/Trim equipment.


Familiarity with Bonding/Grind/Trim equipment operation, optical metrology, and profilometry.


In-depth understanding of Bonding/Grind/Trim process mechanisms.


Understanding of various integration and structural impacts/constraints related to Bonding/Grind/Trim processes.


Understanding of general process steps and process flow for memory processing, particularly planar and vertical NAND memory.


Working knowledge of data analysis systems (e.g., Y3) to analyze experimental data.


Working knowledge of Design of Experiments (DoE).


Proven ability to collaborate with local and overseas teams on projects.


Excellent written and oral communication skills for concise, effective messaging locally and remotely.


Self-motivated and adaptable to Micron’s changing needs, including extended hours if required.


Proven ability to work in a demanding and dynamic environment, prioritizing and managing multiple projects.


Ability to travel for extended periods and to stay at Boise TD for 4-6 months to work on technology development.


Suitable candidates may be considered for expatriate posting to Singapore from overseas locations.


GJS for this position: E3 and above.


Hiring Manager: HE JIAN
Location: Fab10, 1 North Coast Drive, Singapore
Closing Date: 31/07/2025
About Micron Technology, Inc.


We are an industry leader in innovative memory and storage solutions transforming how the world uses information.

With a focus on customers, technology leadership, and manufacturing excellence, Micron delivers high-performance DRAM, NAND, and NOR memory and storage products.

Our innovations fuel the data economy enabling AI and 5G across data centers to edge and client devices.


To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.


Please contact for assistance with the application process or reasonable accommodations.


Micron prohibits the use of child labor and complies with all applicable labor laws and standards.

Micron does not charge candidates recruitment fees or any other payments.


AI alert: Candidates are encouraged to use AI tools to enhance resumes; misrepresentation of qualifications will result in disqualification.


Fraud alert: Verify communications claiming to be from Micron by checking the official Micron careers website.


Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Other
Industries
Computer Hardware Manufacturing
Appliances, Electrical, and Electronics Manufacturing
Semiconductor Manufacturing
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Required Skill Profession

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