Position title: Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)
Location: Sembawang
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $4000 - $8000 (depends experience)
Overview
We are seeking a highly skilled engineer to join our advanced semiconductor packaging team.
The ideal candidate will specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding .
This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.
Key Responsibilities
- Thermo-Mechanical Simulation & Modelling
- Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.
Perform thermo-mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes.
- Thermal Flow & Process Interaction Simulate and optimize thermal transfer efficiency during bonding to minimize die stress and void formation.
Evaluate and recommend process parameters for improved bond uniformity and reliability .
Work with process and materials engineers to correlate simulation results with empirical bonding performance .
- Cross-Functional Collaboration Collaborate with package design , materials , and process development teams to identify design improvements.
Support failure analysis activities through root-cause investigation based on thermal and mechanical simulation.
Provide simulation insights to guide material selection (underfill, die attach, interposer, substrate, etc.).
- Reporting & Documentation Prepare detailed technical reports, simulation summaries, and presentations.
Document modelling assumptions, boundary conditions, and validation processes.
Requirements
- M.S. or Ph.D. in Mechanical Engineering , Materials Science , or a related discipline.
- 5+ years of hands-on experience in thermo-mechanical simulation for semiconductor packaging or advanced electronics.
- Proficiency with finite element tools such as ANSYS, Abaqus, COMSOL , or equivalent.
- Strong understanding of package-level thermal and mechanical behaviour , including CTE mismatch , warpage mechanics , and thermal cycling effects .
- Experience with Thermocompression bonding processes, thermal interface materials (TIMs) , and underfill dynamics .
- Knowledge of wafer-level packaging (WLP) , fan-out , or heterogeneous integration .
- Experience in DOE (Design of Experiments) and statistical correlation between modelling and experimental data.
- Familiarity with material property characterization (CTE, modulus, Tg, etc.) relevant to packaging simulation.
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