Position title: Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)
Location: Sembawang
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $4000 - $8000 (depends experience)
Overview
We are seeking a highly skilled engineer to join our advanced semiconductor packaging team.
The ideal candidate will specialize in
thermo-mechanical simulation and analysis
for advanced package architectures, with a focus on
warpage prediction of large packages
and
thermal behaviour during Thermocompression (TC) bonding .
This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.
Key Responsibilities
Thermo-Mechanical Simulation & Modelling
Develop and execute detailed finite element (FEA) models to predict
package warpage
during assembly, reflow, and operation.
Perform
thermo-mechanical stress and strain analysis
to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
Model and analyze
thermal flow and heat distribution
within the package during
Thermocompression bonding
and other thermal processes.
Thermal Flow & Process Interaction Simulate and optimize
thermal transfer efficiency
during bonding to minimize die stress and void formation.
Evaluate and recommend process parameters for improved
bond uniformity and reliability .
Work with process and materials engineers to correlate simulation results with
empirical bonding performance .
Cross-Functional Collaboration Collaborate with
package design ,
materials , and
process development
teams to identify design improvements.
Support
failure analysis
activities through root-cause investigation based on thermal and mechanical simulation.
Provide simulation insights to guide material selection (underfill, die attach, interposer, substrate, etc.).
Reporting & Documentation Prepare detailed technical reports, simulation summaries, and presentations.
Document modelling assumptions, boundary conditions, and validation processes.
Requirements
M.S. or Ph.D. in
Mechanical Engineering ,
Materials Science , or a related discipline.
5+ years
of hands-on experience in
thermo-mechanical simulation
for semiconductor packaging or advanced electronics.
Proficiency with
finite element tools
such as
ANSYS, Abaqus, COMSOL , or equivalent.
Strong understanding of
package-level thermal and mechanical behaviour , including
CTE mismatch ,
warpage mechanics , and
thermal cycling effects .
Experience with
Thermocompression bonding
processes,
thermal interface materials (TIMs) , and
underfill dynamics .
Knowledge of
wafer-level packaging (WLP) ,
fan-out , or
heterogeneous integration .
Experience in
DOE (Design of Experiments)
and
statistical correlation
between modelling and experimental data.
Familiarity with
material property characterization
(CTE, modulus, Tg, etc.) relevant to packaging simulation.
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