Senior Engineer (Thermo-Mechanical Simulation /Semiconductor Packaging) - SS10

Position title: Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)

Location: Sembawang
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $4000 - $8000 (depends experience)

Overview

We are seeking a highly skilled engineer to join our advanced semiconductor packaging team.

The ideal candidate will specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding .

This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.

Key Responsibilities

• Thermo-Mechanical Simulation & Modelling
• Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.
  Perform thermo-mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
  Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes.
  
• Thermal Flow & Process Interaction Simulate and optimize thermal