Senior Engineer -(Thermo-Mechanical Simulation) - Up to $8K |/Semicon Packaging- LY12

Position Title

Senior Engineer – Thermo‑Mechanical Simulation (Semiconductor Packaging)

Location & Working Hours

Sembawang • 5 Day A Week • 9:00am – 6:00pm

Salary

$4,000 – $8,000 (depends on experience)

Contact

Recruiter: Ms Lynne – WA:
No charges will be incurred by candidates for any service rendered.

Legal Notices

TAN LEE XIAN Reg No: R
The Supreme HR Advisory Pte Ltd EA No: 14C7279

Overview

We are seeking a highly skilled engineer to join our advanced semiconductor packaging team.

The ideal candidate will specialize in thermo‑mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding.

This role will involve close collaboration with cross‑functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next‑generation semiconductor products.

Key Responsibilities

• Thermo‑Mechanical Simulation & Modelling
  Develop and execute detailed FEA models to predict package warpage during assembly, reflow, and operation.
  
  Perform thermo‑mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, large interposers).
  
  Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes.
  
  
• Thermal Flow & Process Interaction
  Simulate and optimize thermal