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Urgent! Senior / Engineer – Wafer Bumping Equipment Job Opening In North East Community Development Council – Now Hiring United Test And Assembly Center Limited (UTAC)

Senior / Engineer – Wafer Bumping Equipment



Job description

Responsibilities:

  • Lead Equipment support team for in depth technical analysis
  • Carry out effective planning for CM and PM (inclusive of system setup)
  • Maintain high equipment reliability with minimal resource requirement
  • Equipment startup, installation and maintenance
  • Troubleshooting and provide upgrade or improvement to the equipment
  • Analyze equipment failure mode and carry out continuous improvement plan
  • Liaising and negotiating with external party on parts enquiry and quotation
  • Provide training and guidance to subordinates
  • Participate OEE and capacity improvement projects
  • Generating OPL and operational procedure and document in support of QMS documentation
  • Parts tracking and ordering base on system
  • Vendor negotiation on support and parts inventory
  • ESD system setup and monitoring for all system
  • Risk assessment for existing and new system
  • Smart factory support and maintenance (AMR, CDS system maintenance)

Requirements:

  • Degree in Engineering preferably Mechanical, Electrical, Electronics
  • 3 years of relevant experience preferably in semiconductor industry
  • Good problem-solving skills and communication skills


Required Skill Profession

Other General



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