Overview
Senior / Engineer – Yield & Process Integration.
Focus on process yield engineering and bump process integration.
Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
Responsibilities
- Focus on process yield engineering and bump process integration.
Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
- Analyze data for yield and detect trends.
- Execute CIP (Continuous Improvement Program) or project activities that contribute to yield and cost-efficiency improvements.
- Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.
- Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
- Act as the overall coordinator of customer-initiated BKM exercises.
Requirements
- Degree in Engineering
- Minimum 3 years of relevant experience, preferably in the semiconductor industry
- Familiar with SPC, APQP, and data analysis tools
- Strong problem-solving and analytical skills
Seniority level
Employment type
Job function
- Engineering and Manufacturing
Industries
- Semiconductor Manufacturing
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