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Urgent! (Senior) Etch Process Engineer Job Opening In Singapore, Singapore – Now Hiring Advanced Semiconductor Equipment Technology Singapore Pte. Ltd.

(Senior) Etch Process Engineer



Job description

Advanced Semiconductor Equipment Technology Singapore Pte.

Ltd.

– Yio Chu Kang

The Etch (Senior) Process Engineer develops plasma etch processes for MEMS/CIS/Power Devices/Advanced Packaging and/or memory/logic etch applications in support of our sales activities to customers, during installation and after service care.

Their main duties include process testing and monitoring of the equipment, updating current system processes and conducting assessments of the working condition of our tools.

Principal Accountabilities

  • Develop new plasma etch processes for above mentioned semiconductor industry segments with strong focus on polysilicon and nitride or metal etch.

  • Work with customer to maintain & optimize current plasma etch processes, including coordinating and conducting etch process development.

  • Qualify etch processes in installed base.

  • Work with engineering and product group for continuous improvement project.

  • Participate in customer meetings, escalations and resolve customer problems in a timely manner.

  • Troubleshoot process issues.

  • Keep field operations and management team informed of customer’s evaluation and perception of system performance.

  • Provide technical guidance to less experienced process engineers and/or customer.

  • Any other ad-hoc duties / projects as assigned by Manager.

Education & Experience

  • Min.

    Degree in Engineering or related engineering fields.

  • More than 5 years of relevant experience in process engineering (sustenance or development) in a wafer fab or etch equipment vendor position, preferably with at least 2-3 years experience on Etch process/equipment.

  • Prior field process support or development experience in Inductively Coupled Plasma(ICP) etcher is a must.

  • Technical knowledge of deep Silicon etch using Bosch process on Through Silicon Via(TSV), plasma dicing or deep trench applications is advantageous.

  • Some experience in Capacitively Coupled Plasma(CCP) etcher will be bonus.

  • Independent and willing to accept challenges.

  • Willing to travel both regionally and internationally to support overseas installed base.

  • Flexibility to work on shift/ overtime/ stand‑by/ on‑call/ holidays when required.

  • Bilingual in English and Mandarin, as counterparts are mostly Chinese speaking.

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Required Skill Profession

Business Engineering & Management



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