SENIOR PROCESS ENGINEER

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners.

The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.

We do it all while committing to integrity, sustainability, and giving back to our communities.

Because doing so can fuel the very innovation we are pursuing.

As a Process Engineer in Micron Technology, Inc., you will be working with a team of engineers responsible for process start-up, development and optimization, product yield, quality and reliability improvements, cost reduction, cycle-time & productivity improvements, risk management, solving sophisticated manufacturing line issues and engineering operations such as wafer dispositions and process release qualifications.

This position also identifies, diagnose and troubleshoot complicated process related problems by applying failure analysis, FMEA, 8D, and SPC methodology.

Additional responsibilities include coordinating and executing process/material evaluations and optimization, implement improvements at process steps/loops, participating in new process qualifications, handling internal & customer audits and liaising with material suppliers to achieve best in class yield, quality, cost and risk management objectives.

Responsibilities and Tasks:

• Work closely with cross-functional teams (equipment, integration, R&D, planning) to support new product introductions and process changes related to HBM.
• Establish and optimize process parameters, recipes, and procedures for HBM manufacturing, ensuring compliance with quality and safety standards.
• Lead root cause analysis and corrective actions on yield and process/equipment-related issues.

• Evaluate and recommend new tools, technologies, and upgrades to enhance HBM equipment capabilities.
• Train and mentor junior engineers and technicians on best practices and standard operating procedures.
• Generate and maintain accurate process documentation, FMEA and SPC charts.
• Participate in capacity planning and equipment layout for HBM expansion projects.

Requirements:
• Bachelor's degree in Electrical & Electronics, Chemical, Mechanical, Materials Engineering or equivalent with more than 9 years of relevant semiconductor experience.

• Minimum of 5 years of hands-on semiconductor process engineering experience, preferably on semiconductor packaging process including assembly, bumping and / or RDL process, including hands-on experience working on HBM related technologies.

• Strong understanding of HBM-related processes and technologies, preferably in the area of thermo-compressive bonding, wafer mount, NCF lamination, wafer debond, pre-encap plasma.

• Experience in process development with fundamental understanding to execute to improve maturity for HBM related process
• Problem-solving mindset with a drive for finding effective solutions.
• Understanding on statistical process control and process development with structured DOE.

Required Skill Profession

Engineers