Senior Process Engineer, SMT Process Engineering (IE)
Senior Process Engineer, SMT Process Engineering (IE) at Pepperl+Fuchs Group.
Bei Pepperl+Fuchs vereinen wir Innovationskraft mit dem Bewusstsein für die Traditionen, die unseren Weg zum Erfolg geprägt haben.
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Was uns dabei besonders wichtig ist: eine unterstützende, kollegiale Unternehmenskultur, in der sich unsere Mitarbeiter*innen wertgeschätzt und eingebunden fühlen – als Teil der Pepperl+Fuchs Familie.
Im Zuge unseres kontinuierlichen Wachstums freuen wir uns, Sie als neues Teammitglied für die Position Senior Process Engineer, SMT Process Engineering (IE) willkommen zu heißen.
Role Purpose
Industrialize and deliver PCBA NPI under new ExpressOPS initiatives during product development to achieve manufacturability.
Provide R&D with Design for Manufacturing / Assembly (DFM / DFA) inputs, perform feasibility studies on PCBA, review PCB layout and component specification, develop technical processes and tools, and establish BoM Structure to provide fast sample delivery.
Major Responsibilities
- Industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)
- Act as technical lead of end‑to‑end prototyping needs of PCBA
- Conduct early‑stage technical feasibility assessments of new PCBAs in collaboration with R&D during product design
- Participate and execute the development and validation of new SMT processes and technologies (e.g., LGA, UFBGA, PoP, 0201/01005 components)
- Drive prototyping and pilot builds to evaluate and refine processes prior to volume ramp‑up
- Act as process engineering counterpart for PCBAs in PEP projects from concept through industrialization
- Ensure robust Design for Manufacturing (DFM) input is integrated into PCB and assembly designs early in the development phase
- Provide SMT‑specific guidance on PCB layout, component footprint design, solder joint reliability, and stencil design
- Execute trials and qualifications for new solder pastes, fluxes, nozzles, reflow profiles, etc.
- Execute and maintain SMT process standards, best practices, and design rules in TD projects
- Analyze process data to improve yield, cycle time, and equipment utilization
- Participate in continuous improvement projects leveraging Six Sigma, SPC, DOE, or Lean methodologies
- Monitor and evaluate emerging SMT technologies, materials, and equipment
- Identify opportunities for cost savings or capability expansion through new equipment or process enhancements
- Collaborate with Maintenance + Service, Technology Development, Procurement, and Quality to resolve technical challenges
- Train production and process engineers on new technologies and process changes
- Document and communicate lessons learned and technical know‑how across global teams
- Participate actively in risk assessment (DFMEA & PFMEA) and Design of Experiments (DOE)
- Review, develop and set up BoM and product structure for new PCBA
- Provide PCBA manufacturing expertise to business unit and production to meet time to market, quality and cost
- Develop and implement quality acceptance methods for samples and prototypes with R&D
- Develop and optimize stencil designs, solder paste printing, pick & place programs, reflow profiles, and AOI/AXI strategies
- Develop work instructions and methods for new PCBA
- Verify new component solderability, process window, zero point, and pad design
- Develop machine programs and qualifying new process parameters for various types of machines in SMT
- Troubleshoot production processes during actual build to achieve good quality for customer
- Drive root cause analysis and corrective actions for process‑related issues
- Testing and implementing of new material, new tools and new machines (FAT/SAT) with Technology Development and R&D departments in technology work packages
- Participate & implement technology work packages at SEA regional level
- Analyze data, provide solutions for productivity improvement & structured problem solving
Requirements
- Minimum a Bachelor’s Degree in Electronics / Mechatronics Engineering or equivalent education.
Experience in PCBA Process development an added advantage - Minimum 7 years of industry experience, with hands‑on experience in industrialization and development of SMT, THT and COB assemblies during product development phase
- Industry experience and hands‑on in:
- SMT technologies and setting up machine programs (Pick & Place, Stencil Development, Solder Paste Printing, Solder Paste Inspection, Reflow Soldering Profile Development, Glue Jetting, V‑groove and Router Depaneling, Wave and Selective Soldering)
- COB technologies and setting up machine programs (Die Attach, Wire Bond, GlobTop)
- Soldering technologies and setting up machine programs (Wave Soldering, Selective Soldering, Reflow Soldering, Manual Soldering and Rework Soldering of electronic assemblies)
- Familiarity with IPC standards (IPC‑A‑610, J‑STD‑001, IPC 7711/7721)
- Strong knowledge of SMT equipment (e.g., DEK/MPM printers, Fuji/ASM/Panasonic placement machines, Heller/ERSA reflow ovens, AOI/AXI)
- Possess good knowledge in FMEA, Control plan, APQP, DFSS, and using DOE and SPC to determine the interrelations of process parameters and processes results
- Possess good knowledge and hands‑on expertise in any of this statistical data analysis software: Minitab, JMP or QS‑stat software for process development is an advantage
For further information, please contact Ms Jacqueline Lim; ‑2293;
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