Senior Process Engineer, SMT Process Engineering (IE)
Senior Process Engineer, SMT Process Engineering (IE) at Pepperl+Fuchs Group.
Bei Pepperl+Fuchs vereinen wir Innovationskraft mit dem Bewusstsein für die Traditionen, die unseren Weg zum Erfolg geprägt haben.
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Was uns dabei besonders wichtig ist: eine unterstützende, kollegiale Unternehmenskultur, in der sich unsere Mitarbeiter*innen wertgeschätzt und eingebunden fühlen – als Teil der Pepperl+Fuchs Familie.
Im Zuge unseres kontinuierlichen Wachstums freuen wir uns, Sie als neues Teammitglied für die Position Senior Process Engineer, SMT Process Engineering (IE) willkommen zu heißen.
Role Purpose
Industrialize and deliver PCBA NPI under new ExpressOPS initiatives during product development to achieve manufacturability.
Provide R&D with Design for Manufacturing / Assembly (DFM / DFA) inputs, perform feasibility studies on PCBA, review PCB layout and component specification, develop technical processes and tools, and establish BoM Structure to provide fast sample delivery.
Major Responsibilities
Industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)
Act as technical lead of end‐to‐end prototyping needs of PCBA
Conduct early‐stage technical feasibility assessments of new PCBAs in collaboration with R&D during product design
Participate and execute the development and validation of new SMT processes and technologies (e.g., LGA, UFBGA, PoP, 0201/01005 components)
Drive prototyping and pilot builds to evaluate and refine processes prior to volume ramp‐up
Act as process engineering counterpart for PCBAs in PEP projects from concept through industrialization
Ensure robust Design for Manufacturing (DFM) input is integrated into PCB and assembly designs early in the development phase
Provide SMT‐specific guidance on PCB layout, component footprint design, solder joint reliability, and stencil design
Execute trials and qualifications for new solder pastes, fluxes, nozzles, reflow profiles, etc.
Execute and maintain SMT process standards, best practices, and design rules in TD projects
Analyze process data to improve yield, cycle time, and equipment utilization
Participate in continuous improvement projects leveraging Six Sigma, SPC, DOE, or Lean methodologies
Monitor and evaluate emerging SMT technologies, materials, and equipment
Identify opportunities for cost savings or capability expansion through new equipment or process enhancements
Collaborate with Maintenance + Service, Technology Development, Procurement, and Quality to resolve technical challenges
Train production and process engineers on new technologies and process changes
Document and communicate lessons learned and technical know‐how across global teams
Participate actively in risk assessment (DFMEA & PFMEA) and Design of Experiments (DOE)
Review, develop and set up BoM and product structure for new PCBA
Provide PCBA manufacturing expertise to business unit and production to meet time to market, quality and cost
Develop and implement quality acceptance methods for samples and prototypes with R&D
Develop and optimize stencil designs, solder paste printing, pick & place programs, reflow profiles, and AOI/AXI strategies
Develop work instructions and methods for new PCBA
Verify new component solderability, process window, zero point, and pad design
Develop machine programs and qualifying new process parameters for various types of machines in SMT
Troubleshoot production processes during actual build to achieve good quality for customer
Drive root cause analysis and corrective actions for process‐related issues
Testing and implementing of new material, new tools and new machines (FAT/SAT) with Technology Development and R&D departments in technology work packages
Participate & implement technology work packages at SEA regional level
Analyze data, provide solutions for productivity improvement & structured problem solving
Requirements
Minimum a Bachelor’s Degree in Electronics / Mechatronics Engineering or equivalent education.
Experience in PCBA Process development an added advantage
Minimum 7 years of industry experience, with hands‐on experience in industrialization and development of SMT, THT and COB assemblies during product development phase
Industry experience and hands‐on in:
SMT technologies and setting up machine programs (Pick & Place, Stencil Development, Solder Paste Printing, Solder Paste Inspection, Reflow Soldering Profile Development, Glue Jetting, V‐groove and Router Depaneling, Wave and Selective Soldering)
COB technologies and setting up machine programs (Die Attach, Wire Bond, GlobTop)
Soldering technologies and setting up machine programs (Wave Soldering, Selective Soldering, Reflow Soldering, Manual Soldering and Rework Soldering of electronic assemblies)
Familiarity with IPC standards (IPC‐A‐610, J‐STD‐001, IPC 7711/7721)
Strong knowledge of SMT equipment (e.g., DEK/MPM printers, Fuji/ASM/Panasonic placement machines, Heller/ERSA reflow ovens, AOI/AXI)
Possess good knowledge in FMEA, Control plan, APQP, DFSS, and using DOE and SPC to determine the interrelations of process parameters and processes results
Possess good knowledge and hands‐on expertise in any of this statistical data analysis software: Minitab, JMP or QS‐stat software for process development is an advantage
For further information, please contact Ms Jacqueline Lim; ‐2293;
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