Senior Process Engineer, SMT Process Engineering (IE)

Job description

At Pepperl+Fuchs, we combine a strong commitment to innovation with a deep respect for the traditions that have shaped our success.

From renewable energy and automotive production to water treatment plants and chemical systems, our advanced electronic sensors and automation components enable smooth and safe operations around the globe.


We take pride in fostering a supportive and collaborative workplace culture, where employees feel connected and valued - much like a close-knit family.

As we continue to grow, we are excited to welcome a new team member for the following position:Senior Process Engineer, SMT Process Engineering (IE)**Role Purpose:**Industrialize and deliver PCBA NPI under new ExpressOPS initiatives during product development to achieve manufacturability.

Provide R&D with Design for Manufacturing / Assembly (DFM / DFA) inputs, perform feasibility studies on PCBA, review PCB layout and component specification, develop technical processes and tools, and establish BoM Structure to provide fast sample delivery.The engineer participates in Technology projects and Continuous Improvement projects and acts as a technical authority on SMT process feasibility and innovation, ensuring seamless collaboration with R&D, Technology Development and production teams.**Major Responsibilities:**As part of the Industrial Engineering (IE) Team to deliver PCBA NPI under new ExpressOPS initiatives:* To industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)* Responsible as a technical lead of End-to-End prototyping needs of PCBAAs the Subject Matter Expert, will be responsible for ensuring manufacturing feasibility study is done before accepting PCBAs for industrialization:**Technical Feasibility & Process Development*** Conduct early-stage technical feasibility assessments of new PCBAs in collaboration with R&D during product design* Participate and execute the development and validation of new SMT processes and technologies (e.g., LGA, UFBGA, PoP, 0201/01005 components)* Drive prototyping and pilot builds to evaluate and refine processes prior to volume ramp-up**Collaboration with R&D & PEP Projects*** Act as the process engineering counterpart for PCBAs in PEP (Product Engineering Process) projects from concept through industrialization* Ensure robust Design for Manufacturing (DFM) input is integrated into PCB and assembly designs early in the development phase* Provide SMT-specific guidance on PCB layout, component footprint design, solder joint reliability, and stencil design**Process Standardization & Optimization, collaboration with Technology Development (TD)*** Execute trials and qualifications for new solder pastes, fluxes, nozzles, reflow profiles, etc* Execute and maintain SMT process standards, best practices, and design rules in TD projects* Analyze process data to improve yield, cycle time, and equipment utilization.* Participate in continuous improvement projects leveraging Six Sigma, SPC, DOE, or Lean methodologies**Technology Roadmapping & Innovation*** Monitor and evaluate emerging SMT technologies, materials, and equipment* Identify opportunities for cost savings or capability expansion through new equipment or process enhancements**Cross-functional Support & Knowledge Sharing*** Collaborate with Maintenance + Service, Technology Development, Procurement and Quality to resolve technical challenges* Train production and process engineers on new technologies and process changes.* Document and communicate lessons learned and technical know-how across global teamsYou are responsible to provide R&D with DFM / DFA inputs, review component specifications and PCB layout to ensure PCBA are manufacturable with sustainable good quality:* Participate actively in Risk Assessment (DFMEA & PFMEA) and Design of Experiments (DOE)* Review, develop and setup BoM and product structure for new PCBA* Provide PCBA manufacturing expertise to Business Unit and Production to meet time to market, quality and costYou are responsible together with R&D industrialized PCBAs are passing through relevant laboratory and certification tests:* Develop and implement quality acceptance methods for samples and prototypes with R&DYou are responsible for conceptualize, develop machines and fixtures, and release production processes and parameters in Manufacturing Technologies (SMT / THT / COB):* Develop and optimize stencil designs, solder paste printing, pick & place programs, reflow profiles, and AOI/AXI strategies.* Develop work instructions and methods for new PCBA* Verify new component solderability, process window, zero point, and pad design* Develop machine programs and qualifying new process parameters for various types of machines in SMT* Troubleshoot production processes during actual build to achieve good quality for customer* Drive root cause analysis and corrective actions for process-related issuesYou are the Subject Matter Expert (PCBA), responsible for executing New Technology and Improvement Projects:* Testing and implementing of new material, new tools and new machines (FAT/SAT) with Technology Development and R&D departments in Technology Project Work Packages* Participate & implement Technology Work Packages at SEA regional level* Analyze data, provide solutions for productivity improvement & structured problem solving**Requirements:*** Minimum a Bachelor’s Degree in Electronics / Mechatronics Engineering or equivalent education.

Experience in PCBA Process development an added advantage* Minimum 7years of industry experience, with hands-on experience in industrialization and development of SMT, THT and COB assemblies during product development phase* Industry experience and hands-on in:
+ SMT technologies and setting up machine programs (Pick&Place, Stencil Development, Solder Paste Printing, Solder Paste Inspection, Reflow Soldering Profile Development, Glue Jetting, V-groove and Router Depaneling, Wave and Selective Soldering)
+ COB technologies and setting up machine programs (Die Attach, Wire Bond, GlobTop)
+ Soldering technologies and setting up machine programs (Wave Soldering, Selective Soldering, Reflow Soldering, Manual Soldering and Rework Soldering of electronic assemblies)* Familiarity with IPC standards (IPC-A-610, J-STD-001, IPC 7711/7721)* Strong knowledge of SMT equipment (e.g., DEK/MPM printers, Fuji/ASM/Panasonic placement machines, Heller/ERSA reflow ovens, AOI/AXI)t* Possess good knowledge in FMEA, Control plan, APQP, DFSS, and using DOE and SPC to determine the interrelations of process parameters and processes results* Possess good knowledge and hands-on expertise in any of this statistical data analysis software: Minitab, JMP or QS-stat software for process development is an advantageFor further information, please contact Ms Jacqueline Lim; ; +Fuchs actively promotes diversity, equity, and inclusion and is committed to a policy of equal employment opportunity.

We welcome applications from all individuals, regardless of ethnicity, country of origin, gender, religion, sexual orientation, age, skin color, physical or mental abilities, social background, or any other protected characteristic.

All employment decisions are made based on these principles and in full compliance with applicable federal and state laws.


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