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Physical Scientists
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Job Description
Job Scope
The candidate will be part of the Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME.
His/Her main roles and responsibilities include:
Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post-processing.
Drive innovations in process methodologies, materials, and approaches, and generate intellectual property related to heterogeneous integration platforms.
Collaborate with industry partners to align on and develop the building blocks required for next-generation heterogeneous integration platforms, including equipment capabilities.
Work closely with process integration teams to actively innovate, optimize bonding processes, and troubleshoot for industry and grant projects.
Lead and support competitive grant research project proposals andoversee their successful execution.
File patents and know-hows on new development activities.
Actively document and publish research findings in prestigious journals and conferences.Job Requirements
PhD in Electronics, Microelectronics, Materials Engineering, Materials Science, Chemistry, Physics, or a related field.
Minimum of 5 years' industry experience in 3D heterogeneous integration and wafer bonding technologies, gained in either an academic or industrial setting.
Proven hands-on experience in wafer bonding with in-depth technical knowledge in at least one or more bonding processes and mechanisms (e.g., vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding).
Knowledge of silicon photonics or 3D heterogeneous integration technology platforms is preferred.
Strong skills in experimental design (DOE) and data analysis are preferred.
Demonstrated interpersonal skills with proven ability to collaborate with internal and external stakeholders.
At least 2 years of experience managing projects of moderate complexity is preferred.
Strong oral and written communication skills, with the ability to deliver clear and concise messages to diverse stakeholders.
Self-driven, with a strong interest in next-generation applications of wafer bonding technologies and awareness of industry trends.
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A*STAR is actively hiring for this Senior Scientist (Far BEOL – Advanced Process Modules), IME position
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