Urgent! SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) Job Opening In Woodlands – Now Hiring Global Foundries
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies.
With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
For more information, visit www.gf.com .
Introduction
We are seeking an experienced and highly motivated SMTS Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies.
The ideal candidate will have extensive knowledge and hands-on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes.
This position offers a unique opportunity to work on cutting-edge packaging solutions that will drive the next generation of semiconductor devices.
Responsibilities:
+ Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
+ Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment.
Stay current with industry trends and advancements.
+ Project Management: Develop and maintain project plans, timelines, and budgets.
Coordinate with cross-functional teams to ensure project milestones are met.
+ Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.
+ Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
+ Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production.
Foster a collaborative and innovative environment.
+ Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
+ Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration.
Implement corrective actions and continuous improvement initiatives.
+ Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.
+ Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.
Qualifications
+ Education: Bachelor’s or master’s degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field.
+ Experience: Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role, specifically in 2.5D and 3D heterogeneous integration technologies.
+ Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).
+ Project Management: Proven track record of managing complex projects with cross-functional teams.
+ Problem Solving: Strong analytical and problem-solving skills.
Ability to troubleshoot and resolve technical issues efficiently.
+ Communication: Excellent verbal and written communication skills.
Ability to convey technical information clearly and concisely.
+ Team Player: Demonstrated ability to work collaboratively in a team environment.
Strong leadership and mentorship skills.
+ Innovation: Passion for innovation and continuous improvement.
Ability to drive new ideas and technologies forward.
+ Quality Focus: Commitment to maintaining high-quality standards in all aspects of the job.
+ Adaptability: Ability to adapt to changing priorities and work effectively under pressure.
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce.
We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
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Unlock Your SMTS Integration Potential: Insight & Career Growth Guide
Real-time SMTS Integration Jobs Trends in Woodlands, Singapore (Graphical Representation)
Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for SMTS Integration in Woodlands, Singapore using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 496 jobs in Singapore and 38 jobs in Woodlands. This comprehensive analysis highlights market share and opportunities for professionals in SMTS Integration roles. These dynamic trends provide a better understanding of the job market landscape in these regions.
Great news! Global Foundries is currently hiring and seeking a SMTS Integration Engineer Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) to join their team. Feel free to download the job details.
Wait no longer! Are you also interested in exploring similar jobs? Search now: SMTS Integration Engineer Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) Jobs Woodlands.
An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at Global Foundries adheres to the cultural norms as outlined by Expertini.
The fundamental ethical values are:The average salary range for a SMTS Integration Engineer Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) Jobs Singapore varies, but the pay scale is rated "Standard" in Woodlands. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.
Key qualifications for SMTS Integration Engineer Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) typically include Other General and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.
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Before the Interview:To prepare for your SMTS Integration Engineer Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) interview at Global Foundries, research the company, understand the job requirements, and practice common interview questions.
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