Overview
SMTS ULP CMOS Advanced Packaging D2W Integrator role at GlobalFoundries.
The ULP CMOS product team is looking to hire a development integration engineer to join the Advanced packaging team in our Singapore facility.
Applicants for this position would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer.
Areas of focus include die-to-wafer and wafer-to-wafer integration bonding.
Responsibilities
Lead complex development integration initiatives to meet customer and technology requirements to further GF advanced packaging strategy.
Lead creation of process flows and process recipes to enable meeting product requirements for performance, reliability and defect-free manufacturing.
Ensure methods and processes are in place to test the devices and structures being developed.
Develop and implement methods and procedures for process control and inspection to ensure products are free of flaws and function as designed.
Identify issues and technical challenges, formulate appropriate experiments to understand root cause and improve processes to meet requirements.
Analyze data, physical, electrical or defect reports to determine trends and recommend corrective actions.
Lead and execute continual improvement through the product development process through to manufacturing transfer; freeze developed processes in preparation for manufacturing and meet all product requirements.
May require creation of presentations to provide occasional management or external customer updates.
Collaborate with other projects and/or assignments as needed.
Other Responsibilities
Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs.
Travel
Required Qualifications
Education – BS or higher.
Electrical Engineering or related field.
Bachelor of Science (B.S.) or equivalent degree in Electrical Engineering, Material Science or related field from an accredited university.
Additional professional experience in advanced module development, integration and/or advanced packaging:
B.S. + minimum of 8 years of relevant experience
M.S. + minimum of 7 years of relevant experience
Ph.D. + minimum of 5 years of relevant experience
Skills: Familiarity with integration skills including lot handling, DOE, inline/HOL/ET analysis and monitoring.
Strong communication and coordination skills cross the department and across locations.
Proactive team collaborator.
Fluency in English – written & verbal.
Preferred Qualifications
Project management skills to innovate and execute impactful solutions; ability to navigate ambiguity and track projects to completion.
Strong written and verbal communication skills.
Strong planning and organizational skills.
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing design, development, and fabrication services to technology companies.
With a global manufacturing footprint spanning three continents, GF enables technologies and systems that transform industries.
All offers of employment are conditioned upon successful completion of background checks, medical screenings as applicable and subject to local laws and regulations.
Information about benefits is available at: gf.com/about-us/careers/opportunities-asia
Equal Opportunity
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce.
We believe a multicultural workplace enhances productivity, efficiency and innovation and our employees feel respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
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