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(Sr.) Principal Etch Process Engineer Job Opening In Singapore, Singapore – Now Hiring NXP Semiconductors


Job description

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We are looking for Engineering roles in preparation for the formation of the joint venture of NXP and VIS, known as VSMC.


This posting is for a Etch Process Engineer in a high volume, 300mm wafer manufacturing environment.

The Deep Trench Etch Engineer is responsible for the optimization and sustaining of deep trench etch processes used in advanced semiconductor device fabrication.

This role involves working with plasma etch tools driving process improvements, and collaborating with cross-functional teams to ensure high yield, reliability, and manufacturability of deep trench structures.


Primary Responsibilities:
Develop and optimize deep trench etch processes for silicon and compound semiconductor substrates.

Characterize etch profiles, selectivity, and uniformity using SEM, profilometry, and other metrology tools.


Maintain, upgrade and monitor wafer fabrication equipment in the Etch process area.

Troubleshoot process issues and implement corrective actions to improve yield and reduce defects.


Collaborate with integration, device, Manufacturing, Maintenance, and Process teams to improve overall etch performance.


Lead DOE (Design of Experiments) and SPC (Statistical Process Control) initiatives for process stability.


Monitor statistical process control for high volume manufacturing equipment.


Participate in and/or lead cross-functional and lean activity teams.


Reduce defectivity mechanisms and improve process control
Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities
Drive equipment performance to maximize capacity and yield performance.


Improve cost performance of equipment.


Mentor engineers and provide technical leadership in Etch process improvement.


Required Skills/Experience:
B.S. Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering discipline is required.


Minimum 15 years semiconductor Etch process engineering experience is required.


Experience in Lean Manufacturing a plus
Knowledge of Semiconductor Manufacturing a plus
Ability to deal with multiple issues and shifting priorities
Strong verbal and written communication skills
Ability to interact with multiple disciplines in a 7x24 manufacturing facility
Self-motivated; able to take initiative
Excellent interpersonal skills
Competency in troubleshooting problems
Seniority level
Seniority level Mid-Senior level
Employment type
Employment type Full-time
Job function
Industries Semiconductor Manufacturing
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Process Engineer (Open to hiring fresh graduates)
Chemical Process Engineer (1-year traineeship programme)
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