Sr. Principal Foundry Engineer – Logic/RF Device Expert
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Description: The APAC Central Competence Team partners with external foundries to ensure robust chip supply and technology enablement for NXP's business lines.
This role focuses on driving advanced node technology ramp-up and transfer, with a strong emphasis on logic/RF devices.
The primary responsibility of this role is to lead and support new technology introduction (NTI) and process transfers involving logic/RF technologies, ensuring manufacturability, yield, and performance targets are met.
Responsibilities
Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes.
Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior.
Interface with internal and external stakeholders on critical development and transfer projects.
Lead and steer projects to meet timelines and business objectives.
Make key decisions on process integration, balancing technical, logistical, and strategic factors.
Support NTI process transfers within foundries and NXP joint ventures.
Requirements / Preferences
Bachelor's or Master's degree in Electrical Engineering, Physics, or related field.
Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices.
Proven hands-on experience with HKMG and FinFET technologies in production or development environments.
Deep understanding of semiconductor device physics, especially HKMG and FinFET.
Strong analytical skills in yield enhancement and electrical data analysis.
Fluent in English and Mandarin.
Demonstrated leadership in development, transfer, or ramp-up projects.
Excellent communication and influencing skills.
Proactive, pragmatic, and results-driven mindset.
Experience working with foundries and leveraging external manufacturing capabilities.
Note: This description reflects the information provided and excludes boilerplate and unrelated items.
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