- Expertini Resume Scoring: Our Semantic Matching Algorithm evaluates your CV/Résumé before you apply for this job role: TCB Advanced Semiconductor Packaging Design Engineer YZ11.
Urgent! TCB Advanced Semiconductor Packaging Design Engineer - YZ11 Job Opening In Singapore, Singapore – Now Hiring THE SUPREME HR ADVISORY PTE. LTD.
Position title: TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.
This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
Compliance & Documentation
Document all designs, simulations, and test results according to quality management and IP standards.
Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Good-to-have:
Thermal & Mechanical Analysis
Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.
Required Skills and Qualifications
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum
2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
3D/2D CAD knowledge, with experience in CREO Parametric preferred.
Exposure to CREO Windchill PLM system is a plus.
Experience with TCB or Laser Assisted bonding technologies
is highly preferred.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process
and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience in
design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System
is a plus.
Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Interested applicants, WA your resume to or email your resume to
TAN YEN ZHEN (CHEN YANZHEN) REG NO: R
THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279
#J-18808-Ljbffr
✨ Smart • Intelligent • Private • Secure
Practice for Any Interview Q&A (AI Enabled)
Predict interview Q&A (AI Supported)
Mock interview trainer (AI Supported)
Ace behavioral interviews (AI Powered)
Record interview questions (Confidential)
Master your interviews
Track your answers (Confidential)
Schedule your applications (Confidential)
Create perfect cover letters (AI Supported)
Analyze your resume (NLP Supported)
ATS compatibility check (AI Supported)
Optimize your applications (AI Supported)
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
O*NET Supported
European Union Recommended
Institution Recommended
Institution Recommended
Researcher Recommended
IT Savvy Recommended
Trades Recommended
O*NET Supported
Artist Recommended
Researchers Recommended
Create your account
Access your account
Create your professional profile
Preview your profile
Your saved opportunities
Reviews you've given
Companies you follow
Discover employers
O*NET Supported
Common questions answered
Help for job seekers
How matching works
Customized job suggestions
Fast application process
Manage alert settings
Understanding alerts
How we match resumes
Professional branding guide
Increase your visibility
Get verified status
Learn about our AI
How ATS ranks you
AI-powered matching
Join thousands of professionals who've advanced their careers with our platform
Unlock Your TCB Advanced Potential: Insight & Career Growth Guide
Real-time TCB Advanced Jobs Trends in Singapore, Singapore (Graphical Representation)
Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph below. This graph displays the job market trends for TCB Advanced in Singapore, Singapore using a bar chart to represent the number of jobs available and a trend line to illustrate the trend over time. Specifically, the graph shows 314 jobs in Singapore and 264 jobs in Singapore. This comprehensive analysis highlights market share and opportunities for professionals in TCB Advanced roles. These dynamic trends provide a better understanding of the job market landscape in these regions.
Great news! THE SUPREME HR ADVISORY PTE. LTD. is currently hiring and seeking a TCB Advanced Semiconductor Packaging Design Engineer YZ11 to join their team. Feel free to download the job details.
Wait no longer! Are you also interested in exploring similar jobs? Search now: TCB Advanced Semiconductor Packaging Design Engineer YZ11 Jobs Singapore.
An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at THE SUPREME HR ADVISORY PTE. LTD. adheres to the cultural norms as outlined by Expertini.
The fundamental ethical values are:The average salary range for a TCB Advanced Semiconductor Packaging Design Engineer YZ11 Jobs Singapore varies, but the pay scale is rated "Standard" in Singapore. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.
Key qualifications for TCB Advanced Semiconductor Packaging Design Engineer YZ11 typically include Other General and a list of qualifications and expertise as mentioned in the job specification. Be sure to check the specific job listing for detailed requirements and qualifications.
To improve your chances of getting hired for TCB Advanced Semiconductor Packaging Design Engineer YZ11, consider enhancing your skills. Check your CV/Résumé Score with our free Resume Scoring Tool. We have an in-built Resume Scoring tool that gives you the matching score for each job based on your CV/Résumé once it is uploaded. This can help you align your CV/Résumé according to the job requirements and enhance your skills if needed.
Here are some tips to help you prepare for and ace your job interview:
Before the Interview:To prepare for your TCB Advanced Semiconductor Packaging Design Engineer YZ11 interview at THE SUPREME HR ADVISORY PTE. LTD., research the company, understand the job requirements, and practice common interview questions.
Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the THE SUPREME HR ADVISORY PTE. LTD.'s products or services and be prepared to discuss how you can contribute to their success.
By following these tips, you can increase your chances of making a positive impression and landing the job!
Setting up job alerts for TCB Advanced Semiconductor Packaging Design Engineer YZ11 is easy with Singapore Jobs Expertini. Simply visit our job alerts page here, enter your preferred job title and location, and choose how often you want to receive notifications. You'll get the latest job openings sent directly to your email for FREE!