• Expertini Resume Scoring: Our Semantic Matching Algorithm evaluates your CV/Résumé before you apply for this job role.
Singapore Jobs Expertini

TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) Job Opening In Singapore, Singapore – Now Hiring The Supreme HR Advisory

TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)

    Singapore Jobs Expertini Expertini Singapore Jobs Other General Tcb Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)

Job description

Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.


Responsibilities
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.


Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).


Planning, Scheduling and Costing of Machines Modules.


Oversee fabrication of prototype modules and their integration with TCB platforms.


Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.


Collaborate with Electrical, Vision and Software Engineers for the machine integration.


Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.


Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.


Required Skills and Qualifications
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.


Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.


3D/2D CAD knowledge, with experience in CREO Parametric preferred.

Exposure to CREO Windchill PLM system is a plus.


Experience with TCB or Laser Assisted bonding technologies is highly preferred.


Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).


Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).


Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).


Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.


Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.


Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.


End of description.


#J-18808-Ljbffr

Required Skill Profession

Other General


  • Job Details

Related Jobs

The Supreme HR Advisory Pte Ltd hiring Advanced Semiconductor Packaging Design Engineer Job in North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd
North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd hiring TCB Design Engineer Job in North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd
North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd hiring TCB Design Engineer Job in Admiralty, Admiralty, Singapore
The Supreme HR Advisory Pte Ltd
Admiralty, Admiralty, Singapore
The Supreme HR Advisory Pte Ltd hiring TCB Design Engineer Job in Sembawang Estate, Sembawang Estate, Singapore
The Supreme HR Advisory Pte Ltd
Sembawang Estate, Sembawang Estate, Singapore
The Supreme HR Advisory Pte Ltd hiring TCB Design Engineer Job in Admiralty, Admiralty, Singapore
The Supreme HR Advisory Pte Ltd
Admiralty, Admiralty, Singapore
Molex hiring Engineer, Die Design Job in Singapore
Molex
Singapore
The Supreme HR Advisory Pte Ltd hiring Mechanical Design Engineer  TCB Job in North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd
North East Community Development Council, SG.02, Singapore
Confidential hiring Design Engineer (Material Handling) Job in Singapore
Confidential
Singapore
The Supreme HR Advisory Pte Ltd hiring Semiconductor Production Engineer  Die attach bonder Job in Admiralty, Admiralty, Singapore
The Supreme HR Advisory Pte Ltd
Admiralty, Admiralty, Singapore
Mafe Bento Pte Ltd hiring Packaging Design Job in Singapore
Mafe Bento Pte Ltd
Singapore
InternSG hiring Packaging Design Job in Singapore
InternSG
Singapore
The Supreme HR Advisory Pte Ltd hiring Semiconductor Design Engineer | TCB Bonding Tech | 6K–8K | 5 Days Job in Admiralty, Admiralty, Singapore
The Supreme HR Advisory Pte Ltd
Admiralty, Admiralty, Singapore
Realtek Singapore Private Limited hiring Semiconductor Design Verification Engineer Job in North West Community Development Council, SG.03, Singapore
Realtek Singapore Private Limited
North West Community Development Council, SG.03, Singapore
The Supreme HR Advisory Pte Ltd hiring Laser Process Engineer(Advanced Semiconductor Packaging Job in Sembawang Estate, Sembawang Estate, Singapore
The Supreme HR Advisory Pte Ltd
Sembawang Estate, Sembawang Estate, Singapore
Pyxis CF Pte Ltd hiring Mechanical Design Engineer – Die Ejection Systems Job in Sembawang Estate, Sembawang Estate, Singapore
Pyxis CF Pte Ltd
Sembawang Estate, Sembawang Estate, Singapore
The Supreme HR Advisory Pte Ltd hiring Semiconductor Manufacturing Technician  Die attach bonder Job in North East Community Development Council, SG.02, Singapore
The Supreme HR Advisory Pte Ltd
North East Community Development Council, SG.02, Singapore

Unlock Your TCB Design Potential: Insight & Career Growth Guide


Real-time TCB Design Jobs Trends (Graphical Representation)

Explore profound insights with Expertini's real-time, in-depth analysis, showcased through the graph here. Uncover the dynamic job market trends for TCB Design in Singapore, Singapore, highlighting market share and opportunities for professionals in TCB Design roles.

2400 Jobs in Singapore
2400
2079 Jobs in Singapore
2079
Download Tcb Design Jobs Trends in Singapore and Singapore

Are You Looking for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) Job?

Great news! is currently hiring and seeking a TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) to join their team. Feel free to download the job details.

Wait no longer! Are you also interested in exploring similar jobs? Search now: .

The Work Culture

An organization's rules and standards set how people should be treated in the office and how different situations should be handled. The work culture at The Supreme HR Advisory adheres to the cultural norms as outlined by Expertini.

The fundamental ethical values are:

1. Independence

2. Loyalty

3. Impartiapty

4. Integrity

5. Accountabipty

6. Respect for human rights

7. Obeying Singapore laws and regulations

What Is the Average Salary Range for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) Positions?

The average salary range for a varies, but the pay scale is rated "Standard" in Singapore. Salary levels may vary depending on your industry, experience, and skills. It's essential to research and negotiate effectively. We advise reading the full job specification before proceeding with the application to understand the salary package.

What Are the Key Qualifications for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)?

Key qualifications for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) typically include Other General and a list of qualifications and expertise as mentioned in the job specification. The generic skills are mostly outlined by the . Be sure to check the specific job listing for detailed requirements and qualifications.

How Can I Improve My Chances of Getting Hired for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)?

To improve your chances of getting hired for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules), consider enhancing your skills. Check your CV/Résumé Score with our free Tool. We have an in-built Resume Scoring tool that gives you the matching score for each job based on your CV/Résumé once it is uploaded. This can help you align your CV/Résumé according to the job requirements and enhance your skills if needed.

Interview Tips for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) Job Success

The Supreme HR Advisory interview tips for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules)

Here are some tips to help you prepare for and ace your TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) job interview:

Before the Interview:

Research: Learn about the The Supreme HR Advisory's mission, values, products, and the specific job requirements and get further information about

Other Openings

Practice: Prepare answers to common interview questions and rehearse using the STAR method (Situation, Task, Action, Result) to showcase your skills and experiences.

Dress Professionally: Choose attire appropriate for the company culture.

Prepare Questions: Show your interest by having thoughtful questions for the interviewer.

Plan Your Commute: Allow ample time to arrive on time and avoid feeling rushed.

During the Interview:

Be Punctual: Arrive on time to demonstrate professionalism and respect.

Make a Great First Impression: Greet the interviewer with a handshake, smile, and eye contact.

Confidence and Enthusiasm: Project a positive attitude and show your genuine interest in the opportunity.

Answer Thoughtfully: Listen carefully, take a moment to formulate clear and concise responses. Highlight relevant skills and experiences using the STAR method.

Ask Prepared Questions: Demonstrate curiosity and engagement with the role and company.

Follow Up: Send a thank-you email to the interviewer within 24 hours.

Additional Tips:

Be Yourself: Let your personality shine through while maintaining professionalism.

Be Honest: Don't exaggerate your skills or experience.

Be Positive: Focus on your strengths and accomplishments.

Body Language: Maintain good posture, avoid fidgeting, and make eye contact.

Turn Off Phone: Avoid distractions during the interview.

Final Thought:

To prepare for your TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) interview at The Supreme HR Advisory, research the company, understand the job requirements, and practice common interview questions.

Highlight your leadership skills, achievements, and strategic thinking abilities. Be prepared to discuss your experience with HR, including your approach to meeting targets as a team player. Additionally, review the The Supreme HR Advisory's products or services and be prepared to discuss how you can contribute to their success.

By following these tips, you can increase your chances of making a positive impression and landing the job!

How to Set Up Job Alerts for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) Positions

Setting up job alerts for TCB Design Engineer (Semiconductor Packaging / Die Handling / Plasma Modules) is easy with Singapore Jobs Expertini. Simply visit our job alerts page here, enter your preferred job title and location, and choose how often you want to receive notifications. You'll get the latest job openings sent directly to your email for FREE!