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TCB Senior Engineer – Thermo-Mechanical Simulation Job Opening In Admiralty – Now Hiring The Supreme HR Advisory Pte Ltd


Job description

Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)

Location: Admiralty
Working Days:  5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $4000 - $8000 (depends experience)

Overview

We are seeking an engineer to join our advanced semiconductor packaging team.

The candidate should specialize in
thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding .

This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.

Key Responsibilities

  • Thermo-Mechanical Simulation & Modelling

  • Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.

  • Perform thermo-mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).

  • Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes.

  • Thermal Flow & Process Interaction

  • Simulate and optimize thermal transfer efficiency during bonding to minimize die stress and void formation.

  • Evaluate and recommend process parameters for improved bond uniformity and reliability.

  • Work with process and materials engineers to correlate simulation results with empirical bonding performance.

  • Cross-Functional Collaboration

  • Collaborate with package design, materials, and process development teams to identify design improvements.

  • Support failure analysis activities through root-cause investigation based on thermal and mechanical simulation.

  • Provide simulation insights to guide material selection (underfill, die attach, interposer, substrate, etc.).

  • Reporting & Documentation

  • Prepare detailed technical reports, simulation summaries, and presentations.

  • Document modelling assumptions, boundary conditions, and validation processes.

Requirements

  • M.S. or Ph.D. in Mechanical Engineering, Materials Science, or a related discipline.

  • 5+ years of hands-on experience in thermo-mechanical simulation for semiconductor packaging or advanced electronics.

  • Proficiency with finite element tools such as ANSYS, Abaqus, COMSOL, or equivalent.

  • Strong understanding of package-level thermal and mechanical behaviour, including CTE mismatch, warpage mechanics, and thermal cycling effects.

  • Experience with Thermocompression bonding processes, thermal interface materials (TIMs), and underfill dynamics.

  • Knowledge of wafer-level packaging (WLP), fan-out, or heterogeneous integration.

  • Experience in DOE (Design of Experiments) and statistical correlation between modelling and experimental data.

  • Familiarity with material property characterization (CTE, modulus, Tg, etc.) relevant to packaging simulation.

Interested applicants, WA your resume to ‪‪‪‪‪‪‪ ‬‬‬‬‬‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

Required Skill Profession

Other General


  • Job Details

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