TCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)
Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)
Location: Admiralty.
Working Days: 5 Day A Week.
Working hours: 9:00am - 6:00pm.
Salary: $4000 - $8000 (depends experience).
Overview
We are seeking an engineer to join our advanced semiconductor packaging team.
The candidate should specialize in
thermo-mechanical simulation and analysis
for advanced package architectures, with a focus on
warpage prediction of large packages
and
thermal behaviour during Thermocompression (TC) bonding .
This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.
Responsibilities
Thermo-Mechanical Simulation & Modelling
— Develop and execute detailed finite element (FEA) models to predict
package warpage
during assembly, reflow, and operation.
Thermo-mechanical stress and strain analysis
— Perform analyses to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
Thermal flow and heat distribution
— Model and analyze thermal flow within the package during
Thermocompression bonding
and other thermal processes.
Thermal Flow & Process Interaction
— Simulate and optimize thermal transfer efficiency during bonding to minimize die stress and void formation.
Evaluate and recommend process parameters for improved
bond uniformity and reliability .
Work with process and materials engineers to correlate simulation results with
empirical bonding performance .
Cross-Functional Collaboration
— Collaborate with
package design ,
materials , and
process development
teams to identify design improvements.
Support
failure analysis
activities through root-cause investigation based on thermal and mechanical simulation.
Reporting & Documentation
— Prepare detailed technical reports, simulation summaries, and presentations.
Document modelling assumptions, boundary conditions, and validation processes.
Requirements
M.S. or Ph.D. in
Mechanical Engineering ,
Materials Science , or a related discipline.
5+ years
of hands-on experience in
thermo-mechanical simulation
for semiconductor packaging or advanced electronics.
Proficiency with
finite element tools
such as
ANSYS, Abaqus, COMSOL , or equivalent.
Strong understanding of
package-level thermal and mechanical behaviour , including
CTE mismatch ,
warpage mechanics , and
thermal cycling effects .
Experience with
Thermocompression bonding
processes,
thermal interface materials (TIMs) , and
underfill dynamics .
Knowledge of
wafer-level packaging (WLP) ,
fan-out , or
heterogeneous integration .
Experience in
DOE (Design of Experiments)
and
statistical correlation
between modelling and experimental data.
Familiarity with
material property characterization
(CTE, modulus, Tg, etc.) relevant to packaging simulation.
Interested applicants to contact via WA their resume to + 9*** or email to **************@gmail.com.
Note:
The following company and regulatory lines have been omitted from this refined version to maintain focus on the job responsibilities and qualifications.
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