TCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)

TCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)

Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging)

Location: Admiralty.

Working Days: 5 Day A Week.

Working hours: 9:00am - 6:00pm.

Salary: $4000 - $8000 (depends experience).

Overview

We are seeking an engineer to join our advanced semiconductor packaging team.

The candidate should specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding .

This role will involve close collaboration with cross-functional teams in package design, process engineering, and reliability to ensure robust thermal and mechanical performance across next-generation semiconductor products.

Responsibilities

• Thermo-Mechanical Simulation & Modelling — Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.
  
  
• Thermo-mechanical stress and strain analysis — Perform analyses to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
  
  
• Thermal flow and heat distribution — Model and analyze thermal flow within the package during Thermocompression bonding and other thermal processes.
  
  
• Thermal Flow & Process Interaction — Simulate and optimize thermal