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Urgent! Wet Etch Process Engineer Job Opening In Singapore, Singapore – Now Hiring ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.

Wet Etch Process Engineer



Job description

Job Responsibilities

Process Development & Optimization

  • Develop and optimize wet etching processes for substrate layers.

  • Design experiments (DOE) to evaluate and improve critical etch parameters (e.g., etch rate, uniformity).

  • Establish and maintain robust process windows for R&D and volume production.

Equipment & Materials Management

  • Define equipment requirements and manage tool qualifications (e.g., acid/ultrasonic cleaning, wet benches).

  • Monitor and maintain etching tool performance, chemistry concentration, and bath lifetime.

  • Evaluate and select etchants, and chemistry blends suitable for advanced substrates.

Yield, Quality & Defect Control

  • Identify and resolve etching-related defects such as over-etch, or residues.

  • Analyze root causes of defects using SEM, optical inspection, and profilometry tools.

  • Collaborate with upstream/downstream processes to improve overall line yield and substrate performance.

Cross-Functional Collaboration

  • Work closely with plating, lithography, CMP, and lamination teams to ensure seamless process integration.

  • Support new product introductions (NPI) and customer qualifications with process stability and repeatability.

Documentation & Compliance

  • Create and maintain technical documentation such as process specifications, control plans, FMEAs, and work instructions.

  • Ensure processes comply with environmental, safety, and chemical handling regulations.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

  • PhD or Master's degree in Chemical Engineering, Materials Science, Microelectronics, or related field.

  • 5–10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.

  • Familiar with substrate materials such as ABF, PID, PI, or photoresists.

  • Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.

Specialized Knowledge & Skills:

  • Knowledge of Damascene/SAP processes for high-density substrates.

  • Proficiency with process characterization tools (SEM, AFM, XPS, optical profilers).

  • Familiar with SPC, Six Sigma, and yield enhancement methodologies.

  • Strong problem-solving, documentation, and communication skills.


Required Skill Profession

Other General



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